| HS Code | 391540 |
| Product Name | DA-1450 RDP |
| Manufacturer | Dialog Semiconductor (Renesas) |
| Product Type | Rapid Development Platform for Bluetooth Low Energy |
| Target Soc | DA1450 family (e.g., DA14580) |
| Form Factor | USB dongle |
| On Board Debugger | Yes, integrated for programming and debugging |
| Virtual Com Port | Yes, enables UART communication over USB |
| User Controls | Push buttons and LEDs |
| Power Sources | USB powered or coin cell battery for power profiling |
| Typical Use | Development, evaluation, and power measurement of DA1450 BLE applications |
As an accredited DA-1450 RDP factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | DA-1450 RDP is packaged in 25 kg multilayer kraft paper bags with a polyethylene liner for moisture protection. |
| Container Loading (20′ FCL) | 20′ FCL: DA-1450 RDP packed in 25kg bags on pallets, shrink-wrapped, securely loaded for safe, dry transport. |
| Shipping | DA-1450 RDP is shipped in moisture-resistant multi-layer paper bags or sealed containers, typically 20 kg each. It should be transported in dry, ventilated containers away from heat, moisture, and direct sunlight. Handle gently to avoid bag damage, and store in a cool, dry warehouse before use. |
| Storage | Store DA-1450 RDP in its original, tightly sealed container in a cool, dry, well-ventilated area. Protect from moisture, humidity, direct sunlight, and high temperatures. Keep away from heat sources, sparks, and incompatible materials. Avoid prolonged exposure to air to prevent caking or degradation. Follow all safety data sheet instructions. |
| Shelf Life | DA-1450 RDP has a shelf life of 12 months when stored unopened in a cool, dry place. |
DA-1450 RDP, resorcinol bis(diphenyl phosphate), CAS 57583-54-7, enters downstream compounding as a liquid aryl phosphate with a typical phosphorus content of 10.8 wt%, density near 1.31 g/cm³ at 25°C, and commercial viscosity commonly reported in the 300–1000 mPa·s range depending on oligomer distribution. In polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS) compounds where the polycarbonate phase must maintain UL 94 V-0 at 1.5 mm without brominated aryl ethers, the phosphate ester is metered at 8–12 wt% into a co-rotating twin-screw extruder with L/D 40:1. Injection is positioned downstream of the first kneading block, at barrel temperatures of 240–270°C, so that the additive does not reach the 300°C boundary where acid species generated by thermal hydrolysis raise melt acid value and produce surface plate-out. Vacuum devolatilization at -0.08 MPa follows the injection port to remove residual phenol, moisture, and low-molar-mass styrene oligomers. The compounded pellet is predried at 80°C for 4 h before moulding, and when ambient relative humidity exceeds 60%, the drying cycle is extended to 6 h because condensed moisture on regrind surfaces accelerates ester hydrolysis and releases phosphoric acid, which can reduce polycarbonate molecular weight and drift the melt flow rate.
Melt flow rate is measured according to ISO 1133-1:2022 at 260°C/2.16 kg; at 10 wt% RDP, the compound typically exhibits an increase of 15–25 g/10 min relative to the unfilled base. The plasticizing response is not linear. Above 12 wt%, heat deflection temperature measured under ISO 75-2:2013 at 1.82 MPa declines by 12–18°C, and notched Izod impact under ISO 180/A falls by 20–30%. This cliff-edge is the principal threshold in thin-wall charger housings that require both V-0 and a minimum impact of 4 kJ/m². An anti-drip package of 0.3–0.5 wt% polytetrafluoroethylene is co-fed to suppress dripping; without it, V-0 is generally not reached below 1.5 mm because the char network formed in the polycarbonate phase is insufficient to arrest vertical flame propagation through the styrene-acrylonitrile continuous phase. Injection moulding is performed on presses with clamp force between 1200 kN and 1800 kN, nozzle melt temperature 255–270°C, and mould surface temperature 65–80°C. Vented barrels are avoided after predrying to exclude atmospheric moisture from the melt film. Terminal parts include notebook base covers, monitor rear housings, router enclosures, and electric vehicle charger connector shells, all requiring V-0 at 1.5 mm, glow-wire ignitability under IEC 60695-2-12 at 750°C, and dielectric strength above 18 kV/mm under IEC 60243-1 for uninsulated live parts.
Polyphenylene ether/high-impact polystyrene blends intended for electrical insulating components receive DA-1450 RDP at 10–18 phr on total resin mass. In a 70/30 PPO/HIPS carrier designed for UL 94 V-0 at 1.6 mm, the common working point is 14 phr; below 10 phr vertical burn performance is not met, and above 18 phr tensile strength measured under ASTM D638-14 drops by more than 15% relative to the unfilled blend. The liquid phosphate functions simultaneously as a flame retardant and as a rheology modifier that reduces torque on 600 Nm-class twin-screw drives. Compounding is carried out at melt temperatures of 240–290°C using a two-stage screw profile. The first high-shear kneading zone disperses the high-viscosity PPO phase before liquid injection; if the phosphate is introduced earlier, the melt film slips on the screw root, residence time distribution widens, and yellow streaking appears in later injection-moulded parts. Pellets are dried at 100°C for 2 h. Injection pressure is set 10–20% lower than an unfilled PPO/HIPS reference, and the melt cushion is controlled below 5 mm to limit hold-pressure variation in multi-cavity tooling.
Terminal applications include photovoltaic junction box bodies, circuit breaker arc shields, motor end caps, and air conditioner electrical enclosures. End-product glow-wire testing under IEC 60695-2-11 at 850°C applies to unattended appliance circuits, and comparative tracking index is retained above 250 CTI under IEC 60112 at 14 phr loading. The upper processing boundary remains 300°C; above this temperature the phosphate ester can generate acidic degradation species that attack the polyphenylene ether chain and reduce insulation resistance after thermal aging.
Flexible polyether polyurethane slabstock incorporates DA-1450 RDP into the polyol side at 5–15 php based on total polyol mass. The phosphorus content of the commercial ester permits lower addition than triethyl phosphate while producing a comparable oxygen index elevation under ISO 4589-2. In high-water formulations above 3.5 g water per 100 g polyol, the core exotherm of a 1 m block can exceed 150°C; this thermal load accelerates ester hydrolysis, releases phenol and phosphoric acid, and produces the brown core discoloration known as scorch. To limit degradation, the phosphate is never pre-blended with amine catalysts in the absence of polyol, the polyol premix temperature is held below 35°C, and an epoxy-based acid scavenger is dosed at 0.5–1.0 php. Automotive seat cushions are post-cured for 12 h at 20–25°C and 45–55% RH before cutting because residual core heat and moisture drive hydrolytic release of volatile phenol species that elevate VDA 278 emission values during the first 72 h.
Flame performance is validated by FMVSS 302 horizontal burn rate below 100 mm/min, ISO 3795, and smolder resistance under California TB 117-2013. Fogging behavior is tested under DIN 75201-B; higher-molar-mass phosphate oligomers show lower condensate mass than triphenyl phosphate, but the result remains sensitive to the peak cure temperature. Terminal parts include contoured automotive headrests, seat bolsters, and under-dashboard acoustic insulation pads.
Copper-clad laminate production for halogen-free FR-4 and CEM-3 uses DA-1450 RDP at 8–15 phr in the epoxy resin varnish. The liquid phosphate is pre-dissolved in the ketone or propylene glycol methyl ether solvent phase before hardener and accelerator addition; this sequence prevents local acid-catalyzed advancement of the epoxy resin. The varnish is applied to 7628 glass fabric on a horizontal treater running at 8–12 m/min, and the B-stage prepreg is dried at 120–160°C to remove solvent and partially advance the resin. During combustion, the phosphate ester participates in char formation and raises the decomposition residue above 30 wt% at 700°C under nitrogen in thermogravimetric analysis. Vacuum hot pressing is conducted at 180–200°C and 2.5–3.5 MPa for 90–120 min. The limiting factor is glass transition temperature: in dicyandiamide-cured systems, RDP behaves as a plasticizing modifier, and loadings above 15 phr lower Tg measured under IPC-TM-650 2.4.25 by 8–15°C, which threatens solder float resistance at 288°C for lead-free assembly. Laminates for automotive radar and smartphone mainboards are specified to meet IPC-4101E, UL 94 V-0 at 1.2 mm, and halogen content below 900 ppm Cl, 900 ppm Br, and 1500 ppm total halogen under IEC 61249-2-21. Delamination risk is assessed after pressure cooker exposure at 121°C, 100% RH, and 0.2 MPa for 1 h, followed by solder dip at 288°C. The B-stage must retain residual volatiles below 0.2 wt%; otherwise hydrolyzed phosphate species migrate toward the copper foil interface and produce wedge voids in the oxide treatment layer.
Thermoplastic polyurethane jacketing for charging cables and industrial cords incorporates DA-1450 RDP at 8–15 wt% into a polyether TPU with Shore hardness 85A to 95A. This route avoids the 50–60 wt% magnesium hydroxide or aluminium trihydrate dosage that would push compound density above 1.4 g/cm³ and destroy flex performance. The TPU resin is predried at 90°C for 3 h to below 0.02 wt% moisture, and the phosphate ester is injected into the melt after the first kneading zone of a twin-screw extruder at 180–200°C. Vacuum extraction at -0.09 MPa removes ester hydrolysis products; without vacuum, residual moisture regenerated from the TPU chain creates surface porosity during cable jacket extrusion. Vertical flame testing is performed under UL 1581 VW-1, and single-core flame spread is assessed under IEC 60332-1-2. The rigid char generated by RDP restricts dripping during the repeated 15 s flame application. Tensile properties are tested under DIN 53504; at 15 wt% loading, elongation at break falls below 350%, which is insufficient for coiled charger cables requiring repeated flex above 10 000 cycles under a 90° bend test.
The principal boundary is hydrolytic stability in polyester TPU grades. RDP is confined to polyether TPU unless a carbodiimide anti-hydrolysis additive is co-fed at 1–1.5 wt%; in unstabilized polyester TPU, molecular weight loss after 500 h at 85°C/85% RH can exceed 30%. Terminal parts include electric vehicle charging cable sheathing, USB-C cable jackets, and flat industrial sensor cable insulation.
| Application | Test standard | Acceptance criterion | Typical loading |
|---|---|---|---|
| PC/ABS thin-wall housing | UL 94 | V-0 at 1.5 mm | 8–12 wt% |
| PPO/HIPS electrical enclosure | IEC 60695-2-11 | 850°C glow-wire | 10–18 phr |
| Flexible polyether foam | FMVSS 302 | Burn rate below 100 mm/min | 5–15 php |
| Halogen-free FR-4/CEM-3 | IEC 61249-2-21 | Total halogen below 1500 ppm | 8–15 phr |
| TPU cable jacket | UL 1581 VW-1 | No dripping during 15 s flame | 8–15 wt% |
Competitive DA-1450 RDP prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615380400285 or mail to sales2@liwei-chem.com.
We will respond to you as soon as possible.
Tel: +8615380400285
Email: sales2@liwei-chem.com
Flexible payment, competitive price, premium service - Inquire now!
DA-1450 RDP is a spray-dried redispersible polymer powder supplied as a free-flowing white powder and formulated for dry-mix cementitious products. The polymer base is a vinyl acetate-ethylene copolymer carried on a mineral anti-blocking agent, and the grade is directed to factory-produced tile adhesives, self-leveling underlayments, skim coats, and repair mortars. The model designation DA-1450 RDP does not encode a single polymer parameter; open secondary sources provide limited published data for this specific configuration, and procurement specifications should rely on lot-specific certificates. At addition levels of 1.5 wt% to 4.0 wt% of total dry mix, the powder acts as a water-redispersible binder that supplements Portland cement and improves wetting, consistency retention, and adhesion to dense substrates. It is not designed to replace cement or to serve as the sole binder in non-cementitious formulations.
In horizontal twin-shaft paddle mixers with batch capacities between 500 L and 2,000 L, the powder is commonly metered after silica sand and before cement or after cement depending on local feed-tower configuration. Because spray-dried RDP of this type has a bulk density typically between 450 g/L and 550 g/L, loss-in-weight screw feeders must be calibrated for each incoming lot; batch-to-batch variation of ±30 g/L is sufficient to shift auger fill mass by 5% to 8% if the controller operates on volumetric assumptions. Residual moisture in sand should be maintained below 0.2 wt% by ASTM C566, and silo air should be kept below 60% relative humidity. Mixing energy is moderate; prolonged mixing above 8 min at high paddle speed can raise bulk temperature and promote compaction and smearing of the powder onto metal surfaces, especially when the powder is added upstream of fine limestone. Pre-blending of DA-1450 RDP with cellulose ether or starch ether for 30 s to 60 s reduces segregation and improves dispersion homogeneity.
Redispersion in a cementitious matrix depends on dissolution of the polyvinyl alcohol protective colloid in alkaline pore water. Once the mix is gaged with water, the pore solution rises above pH 12 within minutes; the protective colloid dissolves, releasing polymer particles that form a low-viscosity dispersion. The minimum film-forming temperature of DA-1450 RDP is approximately 0 °C, and is usually measured by ISO 2115. At substrate temperatures below the MFFT, film coalescence can be incomplete, and thin-bed tile adhesives may show reduced surface tack and lower adhesion after 7-day water immersion. In standard laboratory mortar formulations, a 50% solids redispersion in water has Brookfield viscosity in the range of 1,000 mPa·s to 3,000 mPa·s at 20 rpm and 25 °C, although open-source data for DA-1450 RDP under this exact configuration is limited.
The following specification envelope applies to the class of vinyl acetate-ethylene redispersible powders represented by DA-1450 RDP; values are not a substitute for the manufacturer’s certificate of analysis. Limits that are critical for dosing and dispersion are listed because deviations in ash content, moisture, and sieve residue alter both feeding accuracy and redispersibility.
| Property | Typical range or limit | Test method or basis |
|---|---|---|
| Appearance | White free-flowing powder | Visual inspection |
| Bulk density | 450–550 g/L | ISO 60 |
| Residue on 250 µm sieve | ≤2.0% | ISO 3310-1 test sieve retention |
| Water content | ≤1.5% | ISO 15512 |
| Ash content | 10–14% | ISO 3451-1 |
| pH of 10% aqueous dispersion | 5.5–8.0 | ISO 976 |
| Minimum film-forming temperature | 0 °C nominal | ISO 2115 |
| Glass transition temperature | −10 °C to −15 °C | ISO 11357-2 |
Ash content is primarily the mineral anti-blocking component, typically calcium carbonate or kaolin; it is not an inert filler in the cementitious sense. High ash content can lower film strength and water resistance, while excessively low ash content may compromise powder flow and shelf life. The sieve residue limit is not merely an impurity threshold; oversized particles may survive dry-mix distribution and create visible protrusions in thin skim coats.
Substitution of DA-1450 RDP for a vinyl acetate homopolymer powder generally shifts the minimum film-forming temperature downward from approximately 17 °C to 0 °C, which permits film coalescence at lower substrate temperatures and reduces the need for coalescing solvents. In a C2-class tile adhesive dry mix, this change improves open time and wetting on porcelain tile backs, but may lower early shear strength before 7 days unless cement hydration is sufficient. Compared with high-ethylene vinyl acetate-ethylene grades, DA-1450 RDP provides lower elongation at break and less plastic deformation, which is usually preferable for tile adhesives where dimensional stability under heat ageing is required. It is not the best choice for flexible waterproofing slurries or crack-bridging membranes requiring elongation at break above 100% under ISO 37 or ASTM D412; published data for DA-1450 RDP in such formulations is limited.
When compared with acrylic-based redispersible powders, DA-1450 RDP generally has better wetting on fresh concrete and lower sensitivity to cement alkalinity, but lower exterior UV gloss retention and lower hydrophobicity. The selection therefore favours DA-1450 RDP for structural adhesive applications governed by EN 12004 and ISO 13007-1, whereas acrylic RDP may be preferred in exterior coating applications with direct weathering. No single powder can be assigned as a universal alternative across all test methods.
In a C2 cementitious tile adhesive prepared with 2.5 wt% DA-1450 RDP and tested according to EN 1348, tensile adhesion strength is assessed after defined storage. The EN 12004 classification requires ≥1.0 N/mm² after dry storage, water immersion, heat ageing, and freeze-thaw cycles; for open time after 20 min, the threshold is ≥0.5 N/mm². Formulations containing DA-1450 RDP at 2.0 wt% to 4.0 wt% typically exceed these thresholds when cement content is between 30 wt% and 40 wt%, water dosage is adjusted to obtain a slump of 180 mm to 220 mm, and cure conditions follow the standard. Lower addition levels, below 1.5 wt%, may pass dry adhesion but fail water immersion because polymer film continuity is insufficient to block capillary pores. Higher addition levels, above 4.0 wt%, can reduce compressive strength and increase creep under sustained load.
Compressive strength of a 1:3 mortar with DA-1450 RDP at 2.5 wt% to 3.0 wt% measured by ASTM C109/C109M may be 15% to 25% lower than an unmodified control after 28 days, depending on defoamer addition. The reduction is linked to polymer film porosity and air entrainment; defoamer selection based on ASTM C185 may be required to maintain air content below 3% in fresh mortar. The test trend is not a defect of the polymer but an expected consequence of film formation in the hydrated cement matrix.
In self-leveling underlayments, DA-1450 RDP is added at 1.0 wt% to 3.0 wt% to reduce surface dust and improve tensile strength at the slab interface. Flow is commonly quantified by ASTM C1708/C1708M, and tensile adhesion to concrete after 28 days is typically evaluated by pull-off according to EN 1542; values in excess of 1.0 N/mm² are achievable with 2.0 wt% addition when the substrate is pre-wetted and primed. In repair mortars, the powder improves tensile strength and reduces permeability, but it is not a corrosion-inhibiting admixture and does not replace rust-inhibiting pigments in chloride-exposed repairs.
DA-1450 RDP should be stored in closed bags at temperatures below 30 °C and relative humidity below 60%. The powder is water-sensitive and loses redispersibility if exposed to condensation or if stored beyond the manufacturer’s shelf life. It is incompatible with solvent-borne formulations and should not be dry-mixed with strongly acidic accelerators or with oxidizing agents that can degrade the protective colloid before the powder is dispersed in water.
