| HS Code | 170681 |
| Vinyl Acetate Content | 33% |
| Melt Flow Index | 45 g/10 min (190°C, 2.16 kg) |
| Density | 0.96 g/cm³ |
| Melting Point | 65 °C |
| Vicat Softening Temperature | 45 °C |
| Glass Transition Temperature | -35 °C |
| Tensile Strength | 14 MPa |
| Elongation At Break | 800% |
| Hardness | 75 Shore A |
| Flexural Modulus | 20 MPa |
| Refractive Index | 1.48 |
| Brittleness Temperature | -70 °C |
As an accredited EVATANE 33-45 PV EVA Copolymer Resin,Photovoltaic Encapsulant Film Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied as resin pellets in 25 kg sealed polyethylene bags, palletized and stretch-wrapped for moisture protection during transport and storage. |
| Container Loading (20′ FCL) | 20' FCL loaded with palletized, shrink-wrapped EVATANE resin bags, stably secured; about 20 metric tons per container, dry and ventilated. |
| Shipping | EVATANE 33-45 PV is supplied as thermoplastic EVA resin pellets, packed in sealed multi-layer bags or bulk containers. Ship in dry, ventilated transport to prevent moisture uptake, excessive heat, or UV exposure. Avoid pressure damage, keep away from ignition sources, and store below 30°C until use. |
| Storage | Store EVATANE 33-45 PV in its original sealed packaging in a cool, dry, well-ventilated area. Keep away from direct sunlight, heat sources, open flames, and strong oxidizers. Maintain storage temperature below 30°C and low humidity to prevent moisture absorption. Protect bags from damage and use first-in, first-out rotation. Shelf life is typically 12 months under proper conditions. |
| Shelf Life | Shelf life is typically 2 years when stored unopened in a cool, dry place away from sunlight and heat. |
In conventional glass-backsheet crystalline silicon modules, EVATANE 33-45 PV is compounded into a low-shrinkage encapsulant film that is laminated between the front glass and the cell string, and between the cell string and the backsheet. The resin, with a vinyl acetate content of 33 wt% and a melt flow index of 45 g/10 min at 190 °C/2.16 kg per ISO 1133-1:2022, is fed as the continuous matrix at 98.0–98.8 wt% of the formulated compound. The balance is a peroxide curative at 0.8–1.2 wt%, a trialkoxysilane adhesion promoter at 0.3–0.5 wt%, and an antioxidant/UV stabilizer package at 0.2–0.4 wt%. Compounding is performed on a co-rotating twin-screw extruder with an L/D ratio of 40:1, with barrel zones held at 70–95 °C and a die melt temperature not exceeding 105 °C; process conditions above 110 °C are avoided because typical peroxycarbonate curatives have a one-hour half-life near 119 °C, and localized scorch produces microgel particles that appear as fisheyes in cast film and reduce total light transmittance below the 91% threshold measured by ASTM D1003-21. Film extrusion is run on a chilled-roll cast line, with polished roll temperatures of 15–25 °C, thickness controlled by beta-gauge feedback to 430–500 μm, and tensile winding tension kept below 40 N/1000 mm to prevent orientation-induced shrinkage after lamination. On 2.0 m-wide cast lines, edge bead formation is the dominant film-quality bottleneck; when the die lip gap is not maintained within ±0.05 mm of target, thickness variability at the film edges can exceed ±8%, and the resulting thin regions produce lamination voids over busbars. The downstream lamination sequence places glass/EVA/cell string/EVA/backsheet into a vacuum laminator; the chamber is evacuated below 0.08 MPa, then pressed at 145–150 °C for 12–16 min. After cure, gel content extracted with xylene per ASTM D2765-16 is expected to fall between 80% and 90%; values below 70% are associated with delamination during thermal cycling from -40 °C to +85 °C per IEC 61215-2:2021, while values above 95% can indicate excessive peroxide loading and volatile acetophenone-like byproduct residues. The compound must be pre-dried at 55–65 °C for 4 h when opened bags have been exposed to >60% RH for more than 12 h, and the formulation must be kept free of primary amine-functional additives because amine groups accelerate peroxide decomposition and destabilize silanol condensation at the glass interface. Qualifying terminal modules are typically monocrystalline PERC, TOPCon, or heterojunction panels for residential, commercial, and utility-scale installations, tested to IEC 61215-2:2021, IEC 61730-1:2023, and UL 1703 where applicable, with the compound evaluated as an article component under Regulation (EC) No 1907/2006 and Directive 2011/65/EU.
When EVATANE 33-45 PV encapsulant is used in double-glass or glass-glass bifacial modules, the layup becomes glass/EVA/cell matrix/EVA/glass, and the rear-side EVA film is required to maintain high optical transmittance because the rear glass is transparent. The formulation shifts from the standard glass-backsheet baseline: resin at 98.2–98.7 wt%, peroxide reduced to 0.7–1.0 wt%, silane raised to 0.4–0.6 wt%, acid scavenger added at 0.1–0.3 wt%, and the UV/HALS package raised to 0.3–0.5 wt%. The reduction in peroxide is intentional because the second glass pane restricts outgassing of cure byproducts and acetic acid, and excessive peroxide yields void nucleation at cell edges. The lamination cycle differs substantially from glass-backsheet processing: the complete stack is heated at 140–145 °C for 18–25 min, not 150 °C for 12–14 min, because the second glass sheet acts as a thermal barrier. If the central cell area remains below 135 °C for less than 8 min, the gel content measured by ASTM D2765-16 can drop below 75%, producing creep at elevated operating temperatures and edge delamination after 200 thermal cycles from -40 °C to +85 °C per IEC 61215-2:2021. Production-scale laminator thermocouple mapping has shown a temperature differential of 6–9 °C between the edge and center during the first 10 min of the cycle; laminators with multi-zone silicone bladder heating reduce this differential to 3–4 °C. Adhesion to unprimed glass is monitored with a peel test adapted from ASTM D903-98, with typical values above 50 N/cm after damp heat at 85 °C/85% RH for 1000 h; loss of adhesion below 30 N/cm is a reject condition. The acid scavenger is necessary because EVA hydrolysis under damp heat generates acetic acid, and in a sealed double-glass build the acid cannot escape through a backsheet; without scavenging, the pH at the cell interface can drop sufficiently to corrode silver finger metallization and accelerate potential-induced degradation. If the module design includes a butyl or PIB edge seal, the central EVA film remains protected from moisture ingress, but the edge-seal width must be at least 12 mm to maintain the moisture path length required for insulation resistance under IEC 61730-1:2023. Terminal products are bifacial TOPCon, HJT, and PERC+ modules for utility, agrivoltaic, and snow-reflective installations, qualified to IEC 61215-2:2021, IEC TS 62804-1:2015 for PID resistance, and IEC 62788-1-2:2016 for volume resistivity.
Building-integrated photovoltaic glazing units use EVATANE 33-45 PV as both the PV encapsulant and the safety-glass interlayer, which introduces building-code obligations not present in utility module manufacturing. The formulated interlayer contains the resin at 97.8–98.3 wt%, a peroxide curative at 0.8–1.1 wt%, a silane coupling agent at 0.5–0.8 wt%, a UV/HALS/antioxidant system at 0.3–0.6 wt%, and an acid scavenger at 0.1–0.2 wt%; the higher silane content is required because adhesion to heat-strengthened or tempered glass must survive both photovoltaic qualification and laminated safety glass impact tests. Lamination is performed in a vacuum-bag laminator rather than an autoclave, with a pre-vacuum stage at −0.09 MPa, a heating ramp to 135–145 °C, and a hold period of 25–35 min for a 760 μm interlayer; for thinner 380 μm films, two plies are often placed on the impact side to meet the impact classification under EN 12600:2002. The process conflict in BIPV production is that the long low-temperature cure needed for glass flatness and safety adhesion can leave the center of the laminate under-cured if vacuum pressure is released early; production data show that releasing vacuum before the laminate surface has fallen below 60 °C can create small edge voids and reduce peel adhesion by 10–15% at the glass interface. Compliance for these products is governed simultaneously by photovoltaic standards for fire and electrical safety, including IEC 61730-1:2023 and IEC 61215-2:2021, and by laminated glass standards such as EN ISO 12543-1:2021 and EN 14449:2005. Fire performance may require EN 13501-1 classification, and the EVA interlayer formulation must contain flame-retardant co-additives only when the specific building code requires a defined fire rating; otherwise the additive package is kept at the lower end of the range to avoid transmittance loss. Terminal product types include BIPV curtain-wall units, skylight modules, spandrel panels, balcony balustrades, and overhead canopies, all of which must be tested both as electrical building elements and as safety glazing components.
For lightweight crystalline silicon modules in which the front glass is replaced by a transparent fluoropolymer or weatherable PET sheet, the encapsulant film is laminated against a flexible polymer front sheet and a fiber-reinforced backsheet. The formulation is similar to the glass-backsheet baseline but with resin at 98.3–98.7 wt%, peroxide at 0.9–1.1 wt%, silane at 0.3–0.5 wt%, and a UV package at 0.3–0.4 wt%; film thickness is held to 400–450 μm because excessive thickness increases flexural stiffness and can transfer bending stress to cell microcracks. Lamination uses a flexible diaphragm press at 135–140 °C for 12–16 min, with pressure limited to 0.05–0.08 MPa to prevent cell displacement and silicone bleed through the polymer front sheet. Qualification follows IEC 61215-2:2021 and IEC 61730-1:2023, but the absence of rigid glass changes the mechanical loading conditions: the encapsulant must maintain adhesion to polymer surfaces that have higher moisture-vapour transmission than glass, so edge sealing or a high-barrier backsheet with WVTR below 10-2 g/m²·day is specified in production. Terminal products include low-load commercial rooftop modules, portable off-grid charging panels, vehicle-integrated PV for truck roofs, and marine deck charging sheets.
Extended UV exposure in desert and high-altitude service alters the degradation kinetics of EVA encapsulant films, requiring the stabilizer system to be raised beyond the standard glass-backsheet level. EVATANE 33-45 PV remains the matrix resin at 97.8–98.4 wt%, with peroxide at 0.8–1.1 wt%, silane at 0.4–0.6 wt%, UV absorber/HALS at 0.4–0.6 wt%, and acid scavenger at 0.2–0.5 wt%. The increased silane level is intended to maintain peel adhesion above 50 N/cm after the extended damp-heat and UV sequence, while the acid scavenger reduces degradation products that catalyze chain scission. The downstream extrusion process remains unchanged from the standard cast-film operation, but inline optical inspection filters are set to reject gels and black specks larger than 150 μm because these defects act as local UV absorption sites and initiate early delamination under 15 kWh/m² UV preconditioning in IEC 61215-2:2021; desert-specific service may require repeat doses up to 3× that value. Lamination follows the glass-backsheet schedule at 145–150 °C for 14–18 min, with the upper time limit used when the film includes additional UV stabilizer because stabilizer bloom can reduce adhesion if cure is rushed. Terminal product types are utility-scale monofacial and bifacial modules mounted on single-axis trackers in high-irradiance regions, as well as modules for high-altitude off-grid arrays where UV intensity is elevated relative to sea level. Qualification is conducted to IEC 61215-2:2021, IEC 61730-1:2023, and optical durability screening per IEC 62788-1-4:2020.
| Lamination architecture | EVATANE 33-45 PV | Peroxide | Silane | UV/HALS/AO | Film thickness |
|---|---|---|---|---|---|
| Glass-backsheet c-Si | 98.0–98.8 wt% | 0.8–1.2 wt% | 0.3–0.5 wt% | 0.2–0.4 wt% | 430–500 μm |
| Double-glass bifacial | 98.2–98.7 wt% | 0.7–1.0 wt% | 0.4–0.6 wt% | 0.3–0.5 wt% | 450–600 μm |
| BIPV safety glass | 97.8–98.3 wt% | 0.8–1.1 wt% | 0.5–0.8 wt% | 0.3–0.6 wt% | 760 μm |
| Lightweight polymer sheet | 98.3–98.7 wt% | 0.9–1.1 wt% | 0.3–0.5 wt% | 0.3–0.4 wt% | 400–450 μm |
| High-UV service | 97.8–98.4 wt% | 0.8–1.1 wt% | 0.4–0.6 wt% | 0.4–0.6 wt% | 430–500 μm |
Thin-film glass-glass encapsulation is a moisture-barrier-limited process in which EVATANE 33-45 PV provides the adhesive and stress-dissipating interlayer but not the primary moisture exclusion function. The compound is adjusted to a lower-cure formulation: resin at 98.5–99.0 wt%, peroxide at 0.5–0.8 wt%, silane at 0.2–0.4 wt%, and optional UV stabilizer at 0.1–0.3 wt%. Lamination is performed at 130–140 °C for 15–20 min, below the crystalline silicon cycle, because CdTe and CIGS cell stacks can exhibit contact degradation or TCO sheet resistance increases at higher thermal exposure. The lower temperature is feasible because the high melt index of the resin permits flow at reduced heat; however, gel content must still reach at least 75% by ASTM D2765-16, so the peroxide reduction is accompanied by the longer dwell time. Edge-seal width and desiccant loading are specified by the module manufacturer, and the EVA film is never relied upon to provide WVTR control because its moisture permeability is orders of magnitude higher than the edge-seal materials. Compliance includes IEC 61215-2:2021 and IEC 61730-1:2023, with additional damp-heat performance at 85 °C/85% RH for 1000 h used to validate adhesion retention. Terminal products are utility-scale CdTe and CIGS glass-glass modules and certain semitransparent CIGS architectural units where lamination temperature constraints exclude higher-cure EVA formulations.
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EVATANE 33-45 PV is an ethylene-vinyl acetate copolymer resin specified for photovoltaic encapsulant film extrusion. The grade carries a nominal vinyl acetate comonomer content of 33 wt% and a melt flow rate of 45 g/10 min measured at 190 °C under a 2.16 kg piston load in accordance with ISO 1133-1:2022. Typical density at 23 °C is 0.95 g/cm³ by ISO 1183-1:2019. The melting point determined by differential scanning calorimetry is typically 62 °C to 63 °C in accordance with ISO 11357-3:2018. These values place the grade between lower-vinyl-acetate EVA resins with higher crystallinity and higher-vinyl-acetate grades with lower melt strength. The designation “PV” indicates a dedicated photovoltaic encapsulant film grade rather than a general-purpose film resin; the product is supplied with restrictions on gel particle content, metal residues, and volatile species relevant to long-term module performance. Published data for the complete PV-specific contaminant specification is limited because acceptance windows are frequently set within module qualification programs rather than a single resin datasheet.
| Property | Typical value | Test method |
|---|---|---|
| Vinyl acetate content | 33 wt% | Internal FTIR calibration |
| Melt flow rate | 45 g/10 min | ISO 1133-1:2022, 190 °C, 2.16 kg |
| Density | 0.95 g/cm³ | ISO 1183-1:2019 at 23 °C |
| Melting point | 62 °C to 63 °C | ISO 11357-3:2018 |
| Vicat softening point | 36 °C | ISO 306:2022, A50 |
| Tensile stress at break | 7 MPa | ISO 527-1:2019 |
| Elongation at break | 750 % | ISO 527-1:2019 |
Values are typical and are not to be interpreted as guaranteed specification limits. The resin supplier’s certificate of analysis remains the controlling document for lot acceptance.
In general-purpose EVA film, the primary acceptance criteria are melt flow rate, vinyl acetate content, and mechanical properties. In a photovoltaic encapsulant film, the same resin must also function as an optical medium between glass and cell, an adhesive layer, an electrical insulation layer, and a radical-crosslinkable matrix. The 33 wt% vinyl acetate content provides polar acetate groups that interact with silanol groups on soda-lime glass and with backsheet adhesion layers; this reduces crystalline haze but also increases moisture permeability relative to lower-vinyl-acetate EVA. Gel particles larger than approximately 100 µm produce optical scattering defects and can reduce local dielectric strength. Sodium, potassium, calcium, and iron residues are controlled because mobile ions contribute to potential-induced degradation under high-voltage bias. The resin is also formulated for peroxide curing; the high vinyl acetate content lowers the processing temperature and permits cure at typical vacuum lamination temperatures of 140 °C to 150 °C without excessive crystalline melting.
Adhesion retention is not specified by the resin alone; it is evaluated after lamination through peel tests contained in IEC 61215-2:2021. The encapsulant grade must be compatible with ultraviolet absorbers, silane coupling agents, and peroxide masterbatches without generating premature crosslinking during compounding or film extrusion. An incompatible amine-based additive can destabilize the peroxide and produce gel formation before the lamination step.
The specification of 45 g/10 min melt flow rate is deliberate. A higher melt flow rate of 55 g/10 min or above can provide faster extrusion but reduces melt strength and may increase flow marks on polished chill rolls. A lower melt flow rate of 25 g/10 min improves melt strength but raises melt pressure and limits thin-film throughput. The 33 wt% vinyl acetate content is also deliberate: lower vinyl acetate grades near 28 wt% have higher crystallinity and can leave visible crystalline scattering centers at the edges of the cell; higher vinyl acetate grades above 33 wt% are softer and more difficult to handle but may provide additional glass adhesion. Published data comparing these exact grades in identical module builds is limited; selection is usually confirmed by measuring haze, peel strength, and gel content after lamination under the specific module lamination profile.
Photovoltaic encapsulant sheet is typically produced on single-screw extruders with barrel L/D ratios of 28:1 to 32:1, vacuum venting, and melt filtration. Screen packs rated at 80/120/80 mesh or equivalent depth media are used to remove gels and char particles above 100 µm. The melt is delivered to a coat-hanger slot die with a lip gap of 0.5 mm to 0.8 mm, and the cast film is pinned to a polished chill roll at 15 °C to 25 °C to minimize blocking and control surface quality. Barrel temperatures are profiled from 70 °C in the feed zone to 95 °C at the adapter. Melt temperature is held below 110 °C when peroxide masterbatch is present; excursions above 120 °C create a process risk because the organic peroxide half-life shortens rapidly, and localized cure in the die can produce crosslinked gels that tear the web or leave surface defects. At melt temperatures below 70 °C, melt pressure rises, edge stability deteriorates, and thickness uniformity becomes difficult to maintain. The melt flow rate of 45 g/10 min reduces torque and die pressure relative to a 25 g/10 min EVA grade, enabling higher line speed, but melt strength is lower, so web handling and draw resonance must be controlled. Commercial cast film line speeds for encapsulant sheet are generally in the range of 5 m/min to 25 m/min depending on sheet width and thickness. Batch-to-batch melt flow rate variation outside ±2 g/10 min can shift die pressure and require adjustment of melt pump speed or chill-roll torque to maintain film thickness within specification.
When the resin is compounded with a peroxide masterbatch, the processing margin is set by the peroxide half-life rather than by melt viscosity alone. Typical organic peroxides used in EVA encapsulation have one-hour half-life temperatures in the range of 135 °C to 140 °C. The lamination cure step is therefore designed as a thermal ramp through 140 °C to 150 °C, with hold times of 8 min to 15 min. The high vinyl acetate content of EVATANE 33-45 PV lowers the crystalline melting point so that the encapsulant flows and conforms to cell topography before the cure network builds. Gel content after crosslinking is commonly controlled between 70 % and 90 % by solvent extraction per ASTM D2765, though the target range depends on module construction and backsheet stiffness. Under-cured film below 70 % gel content exhibits creep and poor adhesion retention; over-cured film above 95 % gel content can become brittle and has reduced stress relaxation at the cell edges.
The main performance threshold between EVATANE 33-45 PV and a nominal 28 wt% vinyl acetate EVA is the reduction in crystalline fraction. At 33 wt% vinyl acetate, the melting point is approximately 10 °C lower than that of a 28 wt% vinyl acetate grade, which allows faster melt fusion and more uniform flow during vacuum lamination. The higher polar comonomer content increases adhesion to glass without a separate primer, but it also raises the equilibrium moisture uptake and the potential for acetic acid formation under damp heat. Published data for the specific acetic acid release rate of EVATANE 33-45 PV in an encapsulated module stack is limited; the general behavior of EVA with vinyl acetate contents above 30 wt% is documented in degradation studies conducted under 85 °C and 85 % RH per IEC 61215-2:2021 and IEC TS 62804-1:2015. Compared with a lower melt flow rate EVA grade such as a nominal 25 g/10 min resin, EVATANE 33-45 PV improves line speed and reduces drive load but has lower melt strength and may require narrower die gaps or higher chill-roll tension to maintain gauge. Compared with polyolefin elastomer encapsulants, EVA provides self-adhesion to glass and a faster peroxide cure cycle but has higher water vapor transmission and acetic acid generation potential in damp heat. Polyolefin elastomer is preferred in some glass-glass bifacial or high-voltage module designs when potential-induced degradation and acetic acid corrosion margins are critical.
EVATANE 33-45 PV is typically specified for crystalline silicon photovoltaic modules where the encapsulant layer operates between glass and an active cell layer or backsheet. The cured encapsulant must function as an electrical insulator; volume resistivity and breakdown voltage are system properties measured after lamination according to IEC 60093 and ASTM D257. Module-level qualification generally follows IEC 61215-1:2021, IEC 61215-2:2021, and IEC 61730-1:2023.
| Stress | Condition | Standard basis |
|---|---|---|
| Damp heat exposure | 85 °C, 85 % RH, 1000 h to 2000 h | IEC 61215-2:2021 |
| Potential-induced degradation | 1000 V, 85 °C, 85 % RH or 60 °C, 85 % RH | IEC TS 62804-1:2015 |
| UV preconditioning | 15 kWh/m² to 60 kWh/m² | IEC 61215-2:2021 |
| Electrical insulation | Volume resistivity, system-dependent | IEC 60093, ASTM D257 |
These conditions are module-level test protocols; a resin datasheet does not provide pass/fail values for these system tests. The resin alone cannot guarantee module-level results; glass type, cell metallization, backsheet moisture barrier, lamination profile, and framing system all influence performance.
Operational boundaries for the resin include storage below 30 °C and protection from ultraviolet light. When bags are exposed to relative humidity above 60 % or condensation, pre-drying at 60 °C to 65 °C for 4 h to 6 h is typical before extrusion. Avoid blending with amine-based processing aids because premature peroxide decomposition and crosslinking can occur in the extruder. The material is not intended for sustained uncured service above 80 °C, and the cured encapsulant is not a structural adhesive; edge seal and frame adhesion are separate design inputs. Compliance documentation commonly references REACH Regulation 1907/2006 and RoHS Directive 2011/65/EU, but specific food-contact or medical-grade status requires additional certification. The grade is supplied with a melt flow rate control that supports high-throughput cast film extrusion, but lot-to-lot variation in vinyl acetate content, residual catalyst, and antioxidant concentration should be monitored against a normalized lamination cure curve because these factors shift gel content after curing.