| HS Code | 549772 |
| Materialtype | Ethylene Vinyl Acetate (EVA) encapsulant film |
| Form | Roll film |
| Color | Transparent |
| Thickness | 0.45 mm |
| Density | 0.94 g/cm³ |
| Lighttransmittance | ≥91% |
| Gelcontentaftercure | ≥75% |
| Adhesiontoglass | ≥70 N/cm |
| Adhesiontobacksheet | ≥40 N/cm |
| Curingtemperature | 145-150°C |
| Curingtime | 8-12 min |
| Volumeresistivity | >1×10^15 Ω·cm |
| Dielectricstrength | >18 kV/mm |
| Tensilestrength | ≥16 MPa |
| Elongationatbreak | ≥500% |
| Shelflife | 6 months |
| Storagetemperature | ≤30°C |
As an accredited 3M Solar Encapsulant EVA Film EVA9100 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | |
| Shipping | |
| Storage |
EVA9100 is roll-fed into a vacuum laminator as two discrete sheets with a thickness tolerance of ±0.03 mm. In a monofacial glass-backsheet stack, the layup order is tempered low-iron front glass, EVA9100 front sheet, crystalline silicon cell string, EVA9100 rear sheet, and polymer backsheet. The standard encapsulant specification uses a front-to-rear layer ratio of 1:1, with each sheet at 0.45 mm and a cumulative thickness of 0.90 mm; this corresponds to an encapsulant mass fraction of 8–12 wt% relative to a 3.2 mm front glass and a 0.31 mm PVDF–PET–PVDF backsheet. Compliance is assessed on the finished module under IEC 61215-2:2021, MQT 13, which requires damp heat exposure at 85 °C/85 % RH for 1000 h, followed by adhesion retention, visual inspection, and insulation resistance tests; the complete safety evaluation is performed under IEC 61730-2:2016 and UL 1703 where North American listing is required. The laminator chamber is evacuated to 0.1 mbar or lower before platen temperature increases from 110 °C to 145 °C. Peroxide decomposition accelerates above 135 °C, and a cure plateau of 8–11 min is maintained to reach a gel content above 75 % when measured by solvent extraction per ASTM D2765-16. Production-scale laminators with pin mat lifting systems show a known failure mode when the vacuum release rate exceeds 0.5 bar/min: edge bubbles and backsheet lifting occur because dissolved volatiles cannot escape through the partially crosslinked EVA matrix. Backsheet peel strength to EVA9100 after lamination typically exceeds 60 N/cm on PVDF-based surfaces if the platen temperature is kept above 140 °C; below that temperature, peel strength can drop below 40 N/cm, especially in edge zones where the backsheet temperature is lower than the core. Terminal product types include 60-cell and 72-cell monofacial modules for residential rooftops, commercial flat-roof systems, and utility ground-mount arrays with conventional aluminum frames and junction boxes.
For glass-glass bifacial constructions using 2.0 mm heat-strengthened rear glass, the lamination boundary conditions for EVA9100 shift because the rear cover no longer behaves as a flexible tensile element. The layup order becomes front glass / EVA9100 front sheet / bifacial cell string / EVA9100 rear sheet / rear glass. The typical front sheet is 0.45 mm and the rear sheet is 0.50 mm, producing a total encapsulant thickness of 0.95 mm and a front-to-rear layer ratio of 1:1.1; the slightly thicker rear layer compensates for the lower heat accumulation at the rear glass surface. Qualification follows IEC 61215-2:2021 MQT 11 thermal cycling, MQT 12 humidity-freeze, and MQT 13 damp heat, with additional safety evaluation under IEC 61730-2:2016.
| Parameter | Unit | Monofacial glass-backsheet | Bifacial glass-glass |
|---|---|---|---|
| Front cover | mm | 3.2 | 2.0 |
| Rear cover | mm | 0.31 PVDF–PET–PVDF | 2.0 heat-strengthened glass |
| EVA9100 total thickness | mm | 0.90 | 0.95 |
| Front-to-rear layer ratio | — | 1:1 | 1:1.1 |
| Vacuum chamber lower limit | mbar | 0.1 | 0.08 |
| Cure plateau at setpoint | min | 8–11 | 10–13 |
| Gel content target per ASTM D2765-16 | % | ≥75 | ≥80 |
Process conflict arises from the higher bending stiffness of the glass-glass stack. In a laminator with an upper silicone membrane, the chamber must be evacuated in two stages: the first stage to 50 mbar at 110 °C for gas removal from cell string gaps, the second stage to 0.08 mbar before the membrane applies pressure. If full mechanical pressure is applied before the EVA melts, cell-edge microcracks can develop because the 2.0 mm rear glass does not conform to local thickness variations. The cure plateau is extended to 10–13 min at 145 °C to reach a gel content above 80 %; the higher target is used because glass-glass modules experience greater thermal expansion mismatch during thermal cycling and lower moisture ingress tolerance is required. After lamination, the glass-glass stack is cooled at 1.5–2.0 °C/min to prevent residual stress at the cell-glass interface. Terminal product types include bifacial modules with 2.0 mm/2.0 mm symmetrical glass for agrivoltaic, vertical east-west installations, and utility ground-mount noise-barrier arrays, where rear-side irradiance gain requires the rear encapsulant to maintain transmittance above 85 % in the 380–1100 nm range.
In shingled-cell roof modules, the busbar-free cell strips are connected by electrically conductive adhesive before the encapsulant is laid up. EVA9100 is inserted as a front 0.45 mm sheet and a rear 0.45 mm sheet, giving a 1:1 front-to-rear ratio and a total encapsulant thickness of 0.90 mm; however, the effective thickness over the cell overlap zone is reduced to 0.10–0.15 mm, so the film must have adequate melt flow to fill the inter-strip voids without hydraulically displacing the adhesive-bonded strips. The lamination program is often run at a platen setpoint of 142 °C rather than 145 °C to avoid thermal degradation of the electrically conductive adhesive, and the cure plateau is adjusted to 10–13 min to maintain gel content above 75 % per ASTM D2765-16. This lower setpoint creates a processing window of ±3 °C, because peroxide decomposition below 135 °C is too slow and adhesive embrittlement above 145 °C can increase series resistance. Compliance for the finished module includes IEC 61215-2:2021 MQT 13 for damp heat and UL 61730-2 for safety; hot-spot testing and electroluminescence inspection are used to confirm that adhesive joints are not opened by EVA shrinkage. Terminal product types are all-black shingled roof modules and building-applied photovoltaic roofing elements, typically below 400 W with a black PVDF backsheet and half-cell string arrangement.
When installed as a façade or sloped-glazing element, the photovoltaic laminate is subjected to European safety glazing requirements that do not automatically accept EVA9100 as a safety interlayer. A common BIPV stack comprises 2.8–3.2 mm heat-strengthened front glass, a 0.45 mm EVA9100 front encapsulant, the cell string, a 0.45 mm EVA9100 rear encapsulant, and 2.8–3.2 mm heat-strengthened rear glass. The EVA layers represent a front-to-rear ratio of 1:1 and a total thickness of 0.90 mm; if the building code requires laminated safety glass classification under EN 12600:2002, the laminate is tested by drop impact and classified by breakage pattern. EVA9100-containing laminates may achieve Class 2B when the glass plies are designed to retain fragments, but published data for Class 1B with EVA9100 alone is limited, and many façade specifications require an additional 0.76 mm or 1.52 mm PVB or SGP interlayer. Lamination is performed as a two-stage process: the first stage at 120 °C under partial vacuum removes air from cell edges, and the second stage at 145 °C for 9–12 min reaches gel content above 75 %. The laminate is then subjected to EN 13501-1 fire classification testing, where the encapsulant alone does not determine the reaction-to-fire class; the entire glass-cell assembly must be tested. Operational boundaries include vertical façade surface temperatures above 70 °C, where EVA creep can produce edge delamination if the EVA9100 layer thickness exceeds 0.45 mm and the laminate edges are not sealed against moisture. Terminal product types include BIPV façades, canopies, balustrades, and skylights, with edge sealants specified to prevent moisture ingress at the EVA-glass edge.
Vehicle-integrated photovoltaic laminates impose thermal cycling loads that extend from -40 °C to +105 °C, with the encapsulant serving as both optical coupling layer and stress absorber over curved glass or polymer substrates. EVA9100 is typically laid up in a two-layer stack with a total thickness of 0.60–0.90 mm; because automotive glass curvature creates non-uniform pressure distribution in the laminator, some production lines reduce the front sheet to 0.30 mm and the rear sheet to 0.30 mm, resulting in a 1:1 front-to-rear ratio and a thinner total encapsulant layer to limit edge bleed under curved geometry. Conformity is assessed on the completed vehicle-integrated module under IEC 61215-2:2021 thermal cycling and damp heat, supplemented by ISO 16750-4 for automotive environmental loads; additional adhesion tests are performed on the automotive OEM's paint system because EVA adhesion to clear coats can vary by more than 30 % between paint chemistries. Published data for EVA9100-specific adhesion retention on automotive clear coats is limited, so qualification must be performed on the complete stack with the OEM's paint and primer system rather than on glass-only coupons. Lamination uses a vacuum-bag or membrane press with a setpoint of 135–145 °C and a chamber lower limit of 0.08 mbar; after cure, the part is cooled to below 60 °C before demolding to avoid creep. Terminal product types include solar roofs, tonneau covers, and auxiliary power panels for electric vehicles and off-grid transport.
In half-cell and third-cell module formats, the cell string contains narrow gaps of 1.5–3.0 mm between cell edges, and EVA9100 must fill these gaps during the melt phase without shifting the cells from their placement origin. A front layer of 0.50 mm and a rear layer of 0.45 mm are used, giving an asymmetric front-to-rear layup ratio of 1:0.9 and a total encapsulant thickness of 0.95 mm; the thicker front layer compensates for textured glass topography and improves gap filling on the front side. Process qualification uses a vacuum laminator with a platen flatness tolerance of ±0.2 mm and a chamber pressure decay check below 0.08 mbar before membrane activation. A cure plateau at 145 °C for 9–12 min yields gel content of 78–88 % by ASTM D2765-16; below 78 %, damp heat exposure under IEC 61215-2:2021 MQT 13 reveals interfacial voids and backsheet edge lifting, while above 88 % the encapsulant becomes too stiff and can transfer mechanical stress to the cell edges during thermal cycling. Cell displacement after lamination is measured by electroluminescence or X-ray overlay and should not exceed 0.2 mm from the design grid; displacement beyond this value correlates with increased finger microcracking and reduced fill factor. Terminal product types are high-power utility modules with half-cut cell strings and power ratings above 500 W, where low series resistance and stable encapsulation are required for 1500 V system integration.
Competitive 3M Solar Encapsulant EVA Film EVA9100 prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615380400285 or mail to sales2@liwei-chem.com.
We will respond to you as soon as possible.
Tel: +8615380400285
Email: sales2@liwei-chem.com
Flexible payment, competitive price, premium service - Inquire now!
Product designation 3M Solar Encapsulant EVA Film EVA9100 identifies a fast-cure ethylene-vinyl acetate thermoset film formulated for crystalline silicon photovoltaic module lamination. Manufacturer literature describes the film as supplied in roll form at a nominal thickness of 0.45 mm with a thickness tolerance of ±0.03 mm and common slit widths from 300 mm to 1,000 mm. The film is placed between the glass and the backsheet or between two glass sheets in a vacuum laminator; during lamination it melts, fills cell gaps, and crosslinks into a transparent encapsulant layer. The product is intended for use as the primary cell-encapsulating layer in single-glass and double-glass crystalline silicon modules. It is not a replacement for edge sealants, junction box adhesives, or structural glass interlayers.
Roll dimensions and slit tolerances must be confirmed against the laminator’s vacuum bed dimensions. Manufacturer storage guidance typically specifies storage at 10–30 °C and relative humidity below 50% RH, with a shelf life not exceeding 12 months from date of manufacture when unopened. Pre-drying is recommended if the film has been exposed to ambient relative humidity above 60% RH for more than 24 h; the film should be dried at 70 °C for 2–4 h in a forced-air oven. Absorbed moisture lowers adhesion to glass and can generate bubbles during lamination.
Melt rheology is a critical gap-filling parameter. EVA9100 is reported to have a melt flow index of 20–30 g/10 min at 190 °C under 2.16 kg load according to ISO 1133-1:2022. Under lamination temperatures of 145–155 °C, the film forms a low-viscosity melt that penetrates cell texturing and ribbon gaps. For high-efficiency cells with textured surfaces exceeding 2–5 µm pyramid height, adequate melt flow prevents void retention, but excessive flow can cause encapsulant thinning at cell edges. This balance is monitored on production lines by cross-section microscopy and peel adhesion testing.
Use of EVA9100 requires a vacuum laminator with controlled heated platens, typically oil-heated or electric multi-zone platens, PID temperature control, and vacuum capacity of at least −0.098 MPa relative to atmospheric pressure. A representative lamination sequence for a 2.0 m² module begins with a 4–6 min vacuum stage at 150 °C, followed by a 6–8 min press stage at platen pressure 0.08–0.10 MPa, for a total dwell of 10–12 min. The exact dwell time is a function of module area, glass thickness, cell spacing, and backsheet thermal conductivity. Platen temperature uniformity should be maintained within ±5 °C of setpoint; wider gradients produce edge undercure or center overcure.
Laminators with membrane pressure below 0.08 MPa may not adequately remove entrapped air between the film and the backsheet. In single-chamber laminators, a vacuum draw of 5 min before membrane press is commonly required; in three-chamber laminators, the vacuum stage may be shortened to 3 min. Batch-to-batch variation of melt flow index is typically controlled within ±2 g/10 min. Production-scale lamination lines monitor gel fraction via Soxhlet extraction on first article of each batch using xylene at 140 °C for 12 h or an equivalent solvent method.
The crosslinking reaction is initiated by a peroxide curing package. The cure plateau follows first-order decomposition kinetics; once the platen temperature reaches the peroxide activation range, gel fraction increases rapidly. Gel content after cure is measured by solvent extraction with xylene or toluene according to ASTM D2765-16; typical gel fraction for EVA9100 is reported as ≥80% after a 150 °C, 10 min lamination cycle. Residual peroxide content is not typically controlled as a release property, but undercure can be detected by low gel fraction and low peel adhesion to glass. Overcure can increase yellowness and reduce impact toughness of the laminate.
Field failure modes observed on production-scale laminators include edge undercure when platen edge zones are 7–10 °C below center setpoint. The resulting laminate shows cloudy edges, low peel adhesion to glass below 30 N/cm, and microvoids at the cell edge. Corrective action requires rebalancing zonal heaters or reducing the edge-to-center temperature offset to less than 5 °C. This is a batch-to-batch process control issue, not a film variable.
Differentiation from a standard cure EVA is primarily in crosslink kinetics and residual stress. Standard peroxide-cured EVA films often require lamination dwells of 15–20 min at 145–150 °C to reach gel fractions above 75%. EVA9100 is reported to reach similar or higher gel fractions in 8–12 min. The faster cure package reduces cycle time but narrows the tolerance for platen temperature variation. In a multi-chamber laminator with ±5 °C platen uniformity, melt flow and crosslink uniformity are acceptable; with older single-chamber laminators exhibiting ±10 °C gradients, edge regions may remain undercured or show poor backsheet adhesion.
Compared with polyolefin elastomer (POE) encapsulant films, EVA9100 retains the polar vinyl acetate co-monomer, which promotes wetting and adhesion to glass and metallization but generates acetic acid under damp heat. EVA-class films typically contain 28–33 wt% vinyl acetate; product-specific compositional data for EVA9100 is not fully disclosed. Module designs with PID-sensitive cells may require POE or a low-acetic-acid EVA formulation. Compared with PVB-based interlayers, EVA9100 has lower equilibrium moisture uptake and is formulated for vacuum lamination rather than autoclave processing. Compared with silicone encapsulants, EVA9100 has higher modulus and lower gas permeability but lower service temperature capability.
Table 1 lists representative values from manufacturer technical literature for EVA9100. Values are supplied as typical properties, not as batch-release specifications; lamination conditions and substrate selection influence final laminate performance. Where independent data is not available, the table entry states that published data are limited.
| Property | Test method | Representative value |
|---|---|---|
| Nominal film thickness | Micrometer, ASTM D374-16 | 0.45 mm ± 0.03 mm |
| Density | ASTM D792-20 | 0.95 g/cm³ |
| Melt flow index at 190 °C, 2.16 kg | ISO 1133-1:2022 / ASTM D1238-13 | 20–30 g/10 min |
| Gel fraction after cure | ASTM D2765-16 | ≥80% |
| Light transmittance 400–1100 nm | ASTM D1003-13 | ≥91% |
| Haze | ASTM D1003-13 | ≤2% |
| Volume resistivity | IEC 60093 / ASTM D257-14 | ≥1×10^14 Ω·cm |
| Water absorption 24 h, 23 °C | ASTM D570-22 | ≤0.1% |
| Adhesion to glass after lamination | IEC 62788-1-4 | ≥50 N/cm |
Ultraviolet and damp-heat aging are relevant to service life. EVA encapsulant films of this class are typically formulated with hindered amine light stabilizers and UV absorbers. Yellowing index after 1000 h damp heat exposure at 85 °C/85% RH should be evaluated according to ASTM E313-20. For glass-glass modules, acetic acid cannot escape through the backsheet; the encapsulant should be checked for adhesion retention after 2000 h damp heat. Published data for EVA9100 after extended damp heat in glass-glass construction is limited.
For PID resistance, encapsulant volume resistivity is a screening indicator but not a standalone qualification. EVA9100 typically exhibits high initial resistivity, but acetic acid generation under damp heat can reduce module-level shunt resistance. Testing according to IEC TS 62804-1:2015 is required to determine whether a given bill of materials is PID-resistant. Published data for EVA9100 in specific PID-sensitive module stacks is limited; no claim of universal PID resistance is supported without module-level testing. Optical transmittance after damp heat aging is a better indicator of field performance than initial transmittance alone. EVA9100 should be tested in the full module stack under IEC 61215-1:2021 damp heat conditions of 85 °C and 85% RH for 1000 h to detect yellowing or adhesion loss.
Regulatory and type-test status is component-level context; the encapsulant alone is not a certified module. Manufacturer documentation indicates that EVA9100 is formulated to support module qualification sequences when used with compatible substrates. Table 2 summarizes the applicable standards and their role.
| Standard/Regulation | Designation | Role |
|---|---|---|
| Module design qualification | IEC 61215-1:2021 / IEC 61215-2:2021 | Evaluates module performance after environmental aging; encapsulant must not cause delamination, yellowing, or power loss beyond limits. |
| Module safety qualification | IEC 61730-1:2016 / IEC 61730-2:2016 | Evaluates electrical, mechanical, and fire safety of the module construction containing the encapsulant. |
| PID resistance | IEC TS 62804-1:2015 | Assesses potential-induced degradation in c-Si modules; encapsulant contributes to system-level performance. |
| Chemical registration | REACH Regulation (EC) No 1907/2006 | Requires registration and authorization for substances in the European Union. |
| Hazardous substance restriction | RoHS Directive 2011/65/EU | Restricts lead, cadmium, mercury, hexavalent chromium, PBB, and PBDE in electrical and electronic equipment. |
EVA9100 is optimized for fast-cure cycles around 150 °C. The process window narrows when the module stack contains a backsheet with low-temperature shrinkage or a cell technology with temperature-sensitive passivation layers. If the backsheet heat shrinkage onset is below 150 °C, reducing platen temperature to 135 °C increases the required dwell beyond the product’s design window; gel fraction may fall below 75% and residual peroxide can remain. In such cases, differential scanning calorimetry according to ASTM D3418-15 or solvent extraction according to ASTM D2765-16 should be used to verify cure completion.
High-humidity lamination environments also create process conflicts. If the laminator feed area exceeds 60% RH, the film should be pre-dried. Water absorbed before lamination hydrolyses vinyl acetate groups during cure and can reduce adhesion to glass to below 40 N/cm. Acetic acid generated during damp heat exposure also contributes to backsheet corrosion and junction box lead attack; module designs with no breathable backsheet may trap more acetic acid than open-rack designs.
Mechanical compatibility must be checked for cell spacing and ribbon geometry. In modules with thick interconnects exceeding 0.3 mm height, the film thickness of 0.45 mm may be insufficient to fill the gap without entrapped air. A dual-layer construction or thicker encapsulant is then required. The film is not recommended for direct contact with amine-functional edge tapes or some polyamide backsheet stabilizers because amine species can consume the peroxide curing agent and prevent adequate crosslinking. Similarly, the film should not be pre-compounded with amine-based silane adhesion promoters unless specifically validated by the supplier.
Module laminators using automated cell placement should verify the film’s slit width and roll tension control. Roll winding tension above 1.5 N/mm can induce blocking during storage, especially at temperatures above 30 °C. Blocking, if present, appears as local thickness non-uniformity after unwinding and can produce post-lamination bubbles. The film should be allowed to acclimate to 22 °C ± 2 °C for at least 4 h before slitting or feeding into the laminator.