| HS Code | 663931 |
| Product Name | Chang Chun CCP B-12TX |
| Product Type | Brominated epoxy resin solution |
| Appearance | Light yellow transparent viscous liquid |
| Solvent | Toluene/xylene mixture |
| Solid Content | Approximately 60% |
| Bromine Content | Approximately 20% |
| Epoxy Equivalent Weight | Approximately 450 g/eq on solid resin |
| Viscosity | 5,000–15,000 mPa·s at 25°C |
| Specific Gravity | Approximately 1.2 at 25°C |
| Flash Point | Approximately 21°C closed cup |
| Solubility | Insoluble in water; miscible with aromatic organic solvents |
| Recommended Use | Flame-retardant epoxy laminate and PCB material formulations |
| Product Name | Chang Chun CCP B-12TX |
| Manufacturer | Chang Chun Plastics Co., Ltd. |
| Product Family | Thermoplastic phenolic tackifying resin |
| Physical Form | Pale yellow to amber granular solid |
| Color | Pale yellow to amber |
| Softening Point | 95-110 °C (Ring and Ball method) |
| Specific Gravity | 1.03-1.05 at 25 °C |
| Acid Value | ≤5 mg KOH/g |
| Solubility | Soluble in aromatic hydrocarbons, ketones, and esters; insoluble in water |
| Primary Application | Rubber tackifier for tire treads, sidewalls, belts, and hoses |
| Compatible Rubbers | NR, SBR, BR, IIR, and EPDM |
| Shelf Life | 24 months in original unopened packaging |
| Storage Condition | Store in a cool, dry, well-ventilated area away from heat and flames |
| Volatile Content | ≤1.0% |
As an accredited Chang Chun CCP B-12TX factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Chang Chun CCP B-12TX is supplied in sealed 20 kg pails or 200 kg drums, with hazard labeling and handling instructions. |
| Container Loading (20′ FCL) | Chang Chun CCP B-12TX is loaded as a 20-foot full container load, with drums/pallets properly secured for safe transport. |
| Shipping | Ship Chang Chun CCP B-12TX as an epoxy resin/chemical in UN-approved containers with proper labeling and SDS. Transport by truck or sea, protected from moisture, extreme heat, and ignition sources. Ensure containers are sealed, upright, and placarded according to local and international regulations; verify compatibility before loading. Air shipment only if expressly authorized. |
| Storage | Store Chang Chun CCP B-12TX in tightly sealed original containers in a cool, dry, well-ventilated area. Keep away from heat, sparks, open flames, and direct sunlight. Prevent moisture ingress and solvent loss by always closing containers after use. Avoid contact with strong oxidizers or incompatible materials. Follow the Safety Data Sheet and local storage regulations for safe handling. |
| Shelf Life | Shelf life is typically 12 months from date of manufacture when stored unopened in a cool, dry place. |
Chang Chun CCP B-12TX brominated bisphenol A epoxy resin is dissolved as a solid flake in a 70:30 methyl ethyl ketone-to-dimethylformamide solvent blend at 55–65 % solids before being combined with a standard bisphenol A diglycidyl ether and dicyandiamide in flame-retardant FR-4 laminate manufacture. A production varnish formula uses 60–75 parts by weight B-12TX solids to 25–40 parts liquid DGEBA, 4–6 phr dicyandiamide, 0.2–0.4 phr 2-methylimidazole, and 4–6 phr antimony trioxide as a synergist; the antimony trioxide is pre-dispersed on a triple-roll mill to a Hegman gauge grind below 15 µm. The solution viscosity at 25 °C is adjusted to 150–300 mPa·s for vertical roller coating of 7628 E-glass fabric. Treater tower conditions are 150–160 °C for 3–5 min to obtain B-stage prepreg with resin content 42–46 wt% and residual flow 15–25 % per IPC-TM-650 method 2.3.17. Press lamination at 185–195 °C and 2.0–2.5 MPa for 90–120 min yields a laminate with glass transition temperature of 135–145 °C by DSC per IPC-TM-650 method 2.4.24 and T260 above 30 min. Flame retardancy at 1.6 mm is tested to UL 94 V-0; the bromine release mechanism operates through antimony trihalide radical scavenging in the gas phase, so antimony trioxide dispersion quality controls V-0 consistency more than bromine content alone. Because B-12TX contains bromine at 11.5–12.5 wt%, the system cannot be sold as halogen-free under the halogen-free designations of IPC-4101E; it is limited to conventional FR-4.0 laminate specifications.
Flame-retardant potting of rail traction power capacitors uses B-12TX pre-dissolved at 50–60 % solids in a low-viscosity bisphenol A epoxy resin at 60–70 °C, then cooled to 35–40 °C before hardener addition. The blend ratio is 100 parts liquid DGEBA to 40–60 parts B-12TX solids, giving a mixed-system bromine level of 4.5–6.0 wt% after cure; antimony trioxide is added at 3–5 phr. The hardener is methylhexahydrophthalic anhydride at 80–85 phr with 0.3–0.5 phr 1-methylimidazole. Silica filler at 45–55 wt% is dispersed under vacuum to keep mixed viscosity below 4,000 mPa·s at 60 °C. The compound is degassed at 3–5 mbar for 20 min and cured at 100 °C for 2 h plus 140 °C for 5 h. The cured material passes UL 94 V-0 at 3.2 mm and achieves a glass transition temperature of 110–120 °C under ISO 11357-2. Bromine content is measured on the uncured mixed batch by oxygen-flask combustion and ion chromatography before release for encapsulation, because batch-to-batch variation in B-12TX bromine content outside 11.5–12.5 wt% shifts the flame retardancy threshold even when hardener stoichiometry remains unchanged. The compound must be processed below 35 % relative humidity because antimony trioxide moisture adsorption increases void formation and can reduce volume resistivity below 10^12 Ω·m after 85 °C/85 % RH aging per IEC 60093.
For solvent-borne flame-retardant conformal coatings on motor control printed board assemblies, B-12TX is dissolved in methyl ethyl ketone at 50 % solids and blended with liquid bisphenol A epoxy resin at a 50–60 wt% B-12TX loading. The hardener is a modified cycloaliphatic amine at 35–40 phr; the coating is sprayed to 40–80 µm dry film and cured for 30 min at 80 °C. The cured film passes IPC-CC-830 for hydrolytic stability and insulation resistance after 85 °C/85 % RH at 500 V DC. Flame retardancy is evaluated on coated FR-4 coupons per UL 94; formulations require a minimum bromine content of 5–7 wt% in the dry film when no antimony trioxide is present. B-12TX must not be dispersed in high-speed dissolvers at temperatures above 60 °C, because solvent loss from the flake surface raises local viscosity and leaves undissolved gel particles that clog 0.2 mm spray nozzles.
Bonding of aluminium honeycomb wall panels in rail vehicles uses a B-12TX solution in liquid DGEBA at 40–50 wt% loading. The solid flake is dissolved at 65–70 °C and cooled to 25 °C before adding a polyaminoamide hardener at 55–65 phr, fumed silica at 3–5 phr, and 20–30 phr alumina trihydrate. Mixed viscosity is 8,000–12,000 mPa·s at 25 °C, suitable for notched trowel application. The open time is 30–40 min at 23 °C; at 35 °C it falls below 20 min. Cure is 24 h at 23 °C followed by 2 h at 60 °C. The cured adhesive is tested under EN 45545-2 hazard level HL3 for floor and wall panel assemblies, with smoke density Ds max below 150 and heat release MARHE below 60 kW/m² when the full panel construction is tested under ISO 5660-1. B-12TX contributes bromine to the condensed-phase flame-retardant mechanism; the alumina trihydrate contributes water release at 180–200 °C and must be dried to moisture content below 0.5 % before mixing to avoid voiding at the bondline.
Epoxy molding compounds for leadframe packages require B-12TX flake to be milled before it is dry-blended with cresol novolac epoxy and phenol novolac hardener. A typical compound uses 25–35 parts by weight B-12TX per 100 parts cresol novolac epoxy, 50–55 phr phenol novolac hardener, 1,000–1,300 phr spherical silica filler, 1.5–3.0 phr antimony trioxide, 0.5–1.0 phr carnauba wax release agent, and 0.2–0.4 phr triphenylphosphine cure accelerator. The mixture is melt-kneaded in a co-rotating twin-screw extruder at 85–100 °C with a screw speed of 300–450 min⁻¹ and then ground to a median particle size of 25–40 µm. Spiral flow measured to ASTM D3123 is 75–100 cm; a drop below 75 cm indicates either moisture uptake above 0.3 % in the silica or over-advancement of the B-12TX epoxy during compounding. Transfer molding is run at 175 °C with press force adjusted to 6–10 MPa over the chase area and cure time of 90–150 s, followed by post-cure at 175 °C for 4–6 h. Moulded parts pass UL 94 V-0 at 0.8 mm and retain comparative tracking index above 300 V under IEC 60112. The compound must not be processed above 105 °C during kneading because B-12TX brominated aromatic segments begin dehydrobromination at higher stock temperatures, causing gel particles and discoloration.
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Chang Chun CCP B-12TX is an unmodified liquid epoxy resin based on bisphenol-A and epichlorohydrin, supplied by Chang Chun Plastics Co., Ltd. The grade belongs to the diglycidyl ether of bisphenol-A (DGEBA) class and is used as a reactive intermediate in ambient-cure and heat-cured epoxy systems. Manufacturer-published acceptance ranges for the resin include epoxy equivalent weight of 184–190 g/eq by ASTM D1652-24, viscosity of 11,000–15,000 mPa·s at 25 °C by ISO 3219:2021 or ASTM D2196, colour below 50 APHA by ASTM D1209, and density near 1.16 g/cm³ at 25 °C by ASTM D4052. The resin does not contain reactive diluents, and its nominal oxirane functionality is approximately 2.0. Hydrolyzable chloride and total chloride values are lot-dependent; standard liquid DGEBA grades of this type commonly report hydrolyzable chloride below 500 ppm by ASTM D1726, but lot certificates should be requested for specifications relevant to electrical or electronic applications.
The resin can crystallize under temperature cycling below 15 °C; if crystallization occurs, thawing at 40–50 °C for 24 h with slow agitation is required before use. Because the material is a reactive chemical intermediate, viscosity drift during storage is possible if containers are not sealed against atmospheric moisture and carbon dioxide. Partially used containers held longer than 30 days should be blanketed with dry nitrogen.
Pot life is governed by amine-epoxide addition, tertiary amine accumulation, and mass-dependent self-heating. The stoichiometric hardener amount is calculated from the expression phr = (AHEW × 100) / EEW. For an amine hardener with an amine hydrogen equivalent weight of 95 g/eq and resin EEW of 188 g/eq, the required loading is 50.5 phr. At 25 °C, a 200 g mixture may remain fluid for 20–40 min, whereas a 1 kg mass can gel in under 10 min because the surface-to-volume ratio limits heat dissipation. Mixing in a planetary mixer at 25–35 rpm followed by vacuum degassing at 2–5 kPa absolute for 3–5 min reduces entrained air without excessive exotherm. Gel time can be measured by ASTM D2471 or by oscillatory rheometry where storage modulus and loss modulus crossover identifies the gel point.
Stoichiometric error beyond ±5% typically lowers cross-link density, reduces glass transition temperature, and increases solvent uptake. In high-humidity environments above 60% RH, primary amines can react with carbon dioxide to form carbamate, producing a waxy surface layer and intercoat adhesion loss. Application should be avoided when the substrate is within 3 °C of the dew point or when relative humidity exceeds 85%. Where working time must be extended, the formulation should be modified with a latent accelerator or a higher equivalent-weight amine rather than by reducing hardener below the stoichiometric range.
High-build epoxy flooring and tank-lining formulations use CCP B-12TX as the binder phase with 50–65 wt% quartz filler to control shrinkage and exotherm. The filler blend is dispersed under high shear using a dissolver at 1,000–1,500 rpm until a Hegman grind below 50 µm is achieved. Because the resin has no reactive diluent, viscosity can be reduced by preheating to 35–50 °C before filler addition. Cured systems are typically evaluated by ISO 4624 pull-off adhesion, ISO 2812-1 chemical immersion, and ISO 15184 hardness. Aromatic DGEBA networks provide resistance to dilute acids, alkalis, and aliphatic hydrocarbons; however, prolonged contact with ketones, chlorinated solvents, or strongly oxidizing acids requires post-cure and a higher-crosslink-density hardener selection.
Structural adhesive formulations based on CCP B-12TX are compounded with thixotropic agents such as fumed silica at 2–5 wt% and calcium carbonate. The thixotropic index by ASTM D2196 at 1 rpm and 20 rpm should be specified for anti-sag behaviour. Open time is affected by hardener selection; polyamide hardeners give more flexible joints but lower glass transition temperature than cycloaliphatic amines. Tensile lap-shear strength is tested per ASTM D1002 or ISO 4587 on degreased cold-rolled steel or aluminum substrates. Unlike solid DGEBA grades with epoxy equivalent weight above 450 g/eq, B-12TX requires no solvent for reducing viscosity in ambient-cure systems. The solid grade contributes higher molecular weight and flexibility after cure but must be dissolved in xylene or aromatic hydrocarbon blends, increasing volatile organic content under ASTM D2369. B-12TX is therefore selected where high-solids or solvent-free formulations are required, although solid epoxy resins can exhibit slower exotherm due to higher equivalent weight.
Impregnation of continuous glass fabric or roving requires the resin viscosity to fall below approximately 1,000–2,000 mPa·s at the impregnation bath. Heating B-12TX to 40–50 °C lowers viscosity sufficiently for wet-out without reactive diluents. The resin bath should be maintained at constant temperature by a jacketed vessel with recirculating water at 45 °C ± 2 °C. A viscosity-temperature curve should be generated for each lot using ISO 3219:2021 at multiple shear rates to confirm Newtonian behaviour. In filament winding, resin uptake is controlled by nip pressure or doctor blade, and gel time is adjusted with accelerator content. The volatile-free composition avoids loss of diluent during vacuum infusion, reducing porosity in the laminate. Cured composites are characterized by interlaminar shear strength per ASTM D2344 and glass transition temperature per ASTM D3418.
When B-12TX is used in vacuum infusion, degassing at 1–2 kPa absolute for 5–10 min before infusion removes dissolved air. Vacuum integrity should be held at 5 kPa absolute or lower for 15 min prior to resin admission. Because the resin contains no volatile diluent, bubble collapse is not masked by solvent evaporation, and any residual leak will appear as visible microvoids in the cured laminate.
Electrical encapsulation with CCP B-12TX requires control of ionic residues. The selection of a low-chloride hardener and fused silica filler at 60–70 wt% is common. Cured compositions can be screened using IEC 60093 volume resistivity, IEC 60243-1 dielectric strength, and IEC 60068-2-14 thermal shock. Unfilled DGEBA thermosets typically show coefficient of linear thermal expansion below 70 ppm/K at temperatures below glass transition; fused silica-filled systems may reach 30–40 ppm/K. Thermal shock cracking in encapsulated copper coils often originates from the mismatch between copper CTE at 17 ppm/K and the cured resin. Reducing peak exotherm by staged cure, such as 80 °C for 2 h followed by 150 °C for 4 h, limits internal stress. Published data for this specific B-12TX configuration in high-voltage insulation is limited; qualification must be performed on the fully formulated system.
When a potting compound formulated with a reactive diluent-modified DGEBA is re-based on B-12TX, the removal of butyl glycidyl ether or C12–C14 aliphatic glycidyl ether eliminates the monofunctional component that reduces cross-link density. This substitution generally increases cured glass transition temperature and solvent resistance, but raises initial viscosity from the diluent-modified range of 500–1,200 mPa·s to 11,000–15,000 mPa·s at 25 °C. The higher viscosity requires processing through a heated reservoir at 40–50 °C and may reduce maximum filler loading by 5–10 wt% to maintain dispensability. Automatic meter-mix equipment with static mixers of 24–32 elements should be used rather than hand mixing where short gel times are specified. In small-volume potting with complex coil geometry, vacuum potting at 1–5 kPa absolute improves air release but may increase bubble entrapment if moisture is present.
Table 1 provides class-level comparisons for grade selection. The values represent typical published ranges for the resin classes, not a specification for every lot.
| Parameter | CCP B-12TX (unmodified liquid DGEBA) | Solid DGEBA | Reactive diluent-modified DGEBA | Phenolic novolac epoxy |
|---|---|---|---|---|
| Epoxy equivalent weight | 184–190 g/eq | 450–500 g/eq | 160–190 g/eq | 176–181 g/eq |
| Viscosity at 25 °C | 11,000–15,000 mPa·s | >40,000 mPa·s or solid | 500–1,200 mPa·s | 5,000–25,000 mPa·s |
| Nominal epoxy functionality | 2.0 | 2.0 | 2.0 | 2.2–3.6 |
| Typical cured Tg with aromatic amine | 150–180 °C | 70–110 °C | 60–120 °C | 180–250 °C |
| Chemical resistance profile | Moderate aromatic backbone resistance; high cross-link density | Moderate toughness; lower cross-link density | Lower solvent resistance due to monofunctional diluent | High aromatic density; high chemical resistance |
Table 2 lists applicable characterisation methods and condition boundaries for incoming resin and cured-system evaluation.
| Method | Designation | Application boundary |
|---|---|---|
| Epoxy equivalent weight | ASTM D1652-24 | Use for incoming resin acceptance |
| Viscosity | ISO 3219:2021 / ASTM D2196 | Measure at 25 °C; apply temperature correction |
| Colour | ASTM D1209 | Maximum 50 APHA for clear systems |
| Glass transition temperature | ASTM D3418 / ISO 11357-2 | Cured network characterisation only |
| Water absorption | ASTM D570 | 24 h immersion; cured sample |
| Volume resistivity | IEC 60093 | Formulation-dependent electrical insulation |
Storage of CCP B-12TX should be in sealed steel or HDPE containers at 18–25 °C. Partial containers held longer than 30 days should be blanketed with dry nitrogen. Avoid contamination with tertiary amines, imidazoles, boron trifluoride complexes, or strong Lewis acids; these initiate oligomerization and increase viscosity. Preheating should not exceed 60 °C for extended periods because thermal advancement can raise epoxy equivalent weight and reduce reactivity. When handling uncured resin, impermeable nitrile gloves and local exhaust ventilation should be used to minimize skin sensitization. The product should be stored away from strong oxidizers and open flames because the heat of polymerization can be high. Shelf life is typically 12 months from manufacture in original sealed containers, but retesting by ASTM D1652-24 and ISO 3219:2021 is recommended before use after extended storage.
