| HS Code | 856716 |
| Manufacturer | Sichuan EM Technology Co., Ltd. |
| Part Number | DFS1719-06 |
| Product Type | Quartz Crystal Clock Oscillator |
| Series | DFS |
| Nominal Frequency | 17.19 MHz |
| Supply Voltage | 5.0 VDC ±10% |
| Output Type | TTL/CMOS compatible |
| Frequency Stability | ±100 ppm |
| Operating Temperature Range | -20°C to +70°C |
| Package Type | 14-pin DIP |
| Pin Count | 14 |
| Mounting Style | Through Hole |
| Dimensions | 20.5 mm × 13.2 mm × 5.08 mm |
| Duty Cycle | 40/60% |
| Rise Fall Time | 10 ns max |
| Load Capacitance | 50 pF |
| Rohs | Yes |
As an accredited Sichuan EM Technology DFS1719-06 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Sichuan EM Technology DFS1719-06 is supplied in 25 kg sealed plastic drums, with batch labels and safety documentation. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL) for Sichuan EM Technology DFS1719-06: one 20-foot container, properly packed and secured for safe transport. |
| Shipping | Sichuan EM Technology DFS1719-06 should be shipped in sealed, UN-approved containers compatible with its chemical properties. Keep upright, dry, and away from heat, ignition sources, and incompatible materials. Ensure labeling includes the SDS, product identifier, and any applicable hazard markings. Use authorized hazmat transport with spill-containment provisions and emergency response documentation as required. |
| Storage | Store in a cool, dry, well-ventilated area, away from heat, sparks, open flames, and direct sunlight. Keep the container tightly sealed when not in use to prevent moisture ingress and contamination. Maintain the manufacturer’s recommended temperature range, generally 10–30°C unless specified. Ensure stable shelving, segregate from incompatible chemicals, and inspect regularly. |
| Shelf Life | Shelf life: 12 months from manufacture when stored sealed in a cool, dry place away from sunlight. |
The Sichuan EM Technology DFS1719-06 grade is evaluated as a biaxially oriented polyester carrier substrate for aqueous-processable dry film photoresist used in HDI innerlayer patterning. The carrier is laminated onto electrolytic copper foil with the photoresist layer contacting the copper surface. A dual-roll hot-roll laminator fitted with silicone rubber rolls of Shore A 70–80 hardness applies a nip load of 0.2–0.5 N/mm. Lamination speed is maintained at 1.0–2.0 m/min, with roll temperature set at 105–110 °C for acrylic dry film systems. Temperature excursions above +5 °C cause resist softening into the film edges and reduce sidewall definition after development. The carrier should not be exposed to amine-containing cleaning agents because amine residues attack the polyester surface and shift the carrier-to-resist release character.
The resist formulation coated on the carrier typically contains 100 phr methacrylate oligomer blend, 25–40 phr acrylic copolymer binder, 3–7 phr photoinitiator package, 0.05–0.20 phr polymerization inhibitor, and 0.5–1.5 phr adhesion promoter. The carrier surface must resist low-molecular-weight oligomer migration from the resist because migration kinetics in the polymer matrix change the carrier-to-resist peeling force and produce uneven stripping at the exposure stage. Converted dry film is qualified under IPC TM-650 2.4.28.1 for resist adhesion and IPC TM-650 2.3.17.1 for chemical resistance. Carrier haze is measured by ASTM D1003-21; haze below 2.0 % is preferred for conventional contact exposure. For halogen-free builds, the material is screened against IEC 61249-2-21 maximum chlorine and bromine limits.
| Component | Loading |
|---|---|
| Methacrylate oligomer blend | 100 phr |
| Acrylic copolymer binder | 25–40 phr |
| Photoinitiator package | 3–7 phr |
| Polymerization inhibitor | 0.05–0.20 phr |
| Adhesion promoter | 0.5–1.5 phr |
Terminal products include HDI rigid-flex multilayer printed circuit boards with line/space pitch of 40/40 µm or finer, used in smartphone camera modules, automotive ADAS sensor interconnect, and medical endoscopic imaging probes.
In solder mask transfer film converting, the DFS1719-06 grade serves as the peelable substrate after UV exposure and thermal cure of the solder mask layer. The solder mask ink is coated onto the carrier at a wet film thickness of 20–25 µm; the web is dried in a seven-zone air float oven with zone temperatures spanning 60 °C to 110 °C. The dried film is laminated to a copper-clad panel at 105–115 °C and 0.4 MPa nip pressure. After vacuum lamination, UV exposure through the carrier, and post-exposure bake, the carrier is peeled at a 180° angle. Peel force measured by FINAT FTM 3 should remain between 8–15 gf/25 mm. Residual carrier fragments larger than 200 µm on the solder mask surface are rejectable because they interfere with subsequent ENIG nickel deposition. A typical solder mask transfer formulation contains 100 phr epoxy-acrylate hybrid resin, 10–20 phr trifunctional acrylate monomer, 2–5 phr cationic photoinitiator, 20–30 phr barium sulfate filler, and 0.3–0.8 phr leveling agent. The cured film thickness on the panel after carrier removal is controlled to 18–22 µm. The converted solder mask must meet IPC-SM-840D Class T adhesion and chemical resistance requirements. Ionic contamination contributed by the carrier is verified by IPC TM-650 2.3.25 and must remain below 0.5 µg/cm² NaCl equivalent. Terminal products include high-layer-count server backplane boards, RF modules, and automotive engine control units requiring via plugging and chemical resistance to ENIG and OSP surface finishes.
Storage humidity above 65 % RH causes water adsorption on the polyester surface and in the resist layer, shifting the resist-to-carrier peeling force. For uncontrolled storage, the practical upper limit is 60 % RH; above this threshold, pre-drying in a desiccant cabinet at 23±2 °C for 12–24 h is required before lamination. Lamination yield drops when residual moisture exceeds 0.3 wt% because water flashes into steam at the copper interface and generates microvoids in the resist layer.
For 25 µm resist films, the photoinitiator loading is reduced to 2.5–3.5 phr and the inhibitor level is raised to 0.15–0.25 phr to suppress dark reaction during humid storage. The carrier coefficient of friction against stainless steel is controlled to 0.30–0.45 under ASTM D1894-14 to prevent telescoping during roll unwind. On a cut-sheet laminator with an automatic roll feeder, unwind tension is set to 25–35 N for a 500 mm web width. Edge guide accuracy of ±0.5 mm is required; deviation causes resist wrinkling and air entrapment at the panel edge. Batch-to-batch variation in web camber above 0.1 % of roll width produces edge guide tracking faults on automatic roll feeders. Roll format is conditioned under ISO 291 condition B at 23±2 °C and 50±5 % RH. The finished dry film is qualified under IPC TM-650 2.6.3.1 for surface insulation resistance after 96 h at 85 °C/85 % RH, with a minimum SIR of 1×10^8 Ω. Terminal applications are high-density flexible printed circuits and multilayer rigid-flex boards for battery management systems in electric vehicles and semiconductor test sockets.
The DFS1719-06 grade is used as a release liner for UV-curable coverlay adhesive transfer in flexible printed circuit lamination. The adhesive is coated onto the liner at a wet thickness of 50–100 µm and cured by UV LED at 385 nm with a dose of 1.5–3.0 J/cm². The cured adhesive is transferred to polyimide film before bonding to the FPC. Release force is controlled to 6–18 gf/25 mm by applying a solventless silicone system at 0.5–1.0 g/m² on the liner surface. A UV-curable coverlay adhesive formulation contains 100 phr aliphatic urethane acrylate oligomer, 20–40 phr isobornyl acrylate monomer, 3–6 phr photoinitiator, 0.5–1.5 phr silane coupling agent, and 0.2–0.5 phr leveling agent. The transferred adhesive thickness on the polyimide film is 15–25 µm. Release liner cleanliness is tested by liquid particle counting of a solvent rinse; ionic contamination must remain below 0.2 µg/cm² NaCl equivalent because the liner contacts the pressure-sensitive adhesive. Silicone transfer to the adhesive surface is rejected above 0.1 atomic% by XPS. Terminal parts include flexible printed circuit assemblies in foldable OLED smartphones, wearable medical monitors, and EV battery flex harnesses.
The DFS1719-06 grade is converted into laser-cut solder paste stencil film. The substrate is coated with a pressure-sensitive adhesive layer on one side and a silicone release layer on the opposite side. Laser cutting is performed with a 355 nm UV laser at 10–20 kHz, average power 0.5–1.0 W, and cutting speed 200–400 mm/s. The resulting kerf width is held at 15–25 µm. The pressure-sensitive adhesive is coated at 20–30 g/m² dry weight, with a formulation of 100 phr acrylic adhesive, 1.0–2.5 phr isocyanate crosslinker, and 0.3–0.8 phr silane adhesion promoter. Aperture tolerance is controlled to ±5 µm per IPC-7525B. Dimensional stability is tested under ASTM D1204-08 at 150 °C for 30 min; MD shrinkage must remain below 1.5 %. Mechanical properties are tested under ASTM D882-18. The terminal products are SMT solder paste stencils for 0201 components and micro-BGA packages in consumer electronics and LED lighting boards. The use of DFS1719-06 as a stencil substrate is limited to no-clean and water-soluble solder pastes; it is not specified for aggressive solvent-based cleaning regimes unless validated by the paste manufacturer.
| Process parameter | Set range |
|---|---|
| Hot-roll lamination temperature | 105–110 °C |
| Nip load | 0.2–0.5 N/mm |
| Lamination speed | 1.0–2.0 m/min |
| Storage humidity | ≤60 % RH |
| Unwind tension for 500 mm web | 25–35 N |
| Laser stencil kerf width | 15–25 µm |
| Release liner peel force | 6–18 gf/25 mm |
Laser direct imaging photoresists are sensitive to carrier haze and thickness variation. For LDI systems operating at 405 nm, the carrier must have low haze and controlled surface roughness to avoid scattering of the exposure beam. The DFS1719-06 grade is evaluated on an LDI tool with a scan speed of 5–15 mm/s and a beam spot diameter of 2–5 µm. The carrier is peeled before development; thickness variation across the web must be below ±2 % because resist thickness variation shifts the focus plane and degrades line width uniformity. Carrier haze is measured by ASTM D1003-21 and should remain below 1.5 % for fine-line LDI; haze above 2.0 % widens the resolution limit from 25 µm to 40 µm on the same equipment. Surface roughness Ra is tested according to ISO 4287:1997 and should be below 0.3 µm.
The LDI photoresist formulation coated on the carrier contains 100 phr high-contrast acrylate binder, 25–35 phr polyfunctional monomer, 2–4 phr 405 nm photoinitiator, and 0.1–0.4 phr UV absorber to control sidewall profile. The film is screened under RoHS Directive 2011/65/EU Annex II and REACH EC 1907/2006 Annex XVII substances of very high concern. Specific published LDI performance data for DFS1719-06 on a given exposure tool are limited; a 50-panel qualification using a focus matrix is required before release. Terminal products include high-density interconnect boards with 25 µm line/space used in 5G antenna-in-package modules, optical transceivers, and CMOS image sensor substrates.
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Non-reactive phosphate esters such as triphenyl phosphate or resorcinol bis(diphenyl phosphate) introduce phosphorus as a dispersed additive. In cured halogen-free FR-4 formulations at 2.5–3.0 wt% phosphorus, these additives can reduce glass transition temperature by 15–30 °C because they interrupt network packing and do not form covalent network junctions. DFS1719-06, by contrast, provides two phenolic hydroxyl groups. During epoxy advancement, these hydroxyl groups react with oxirane rings and create a phosphorus-containing aromatic diol unit inside the polymer backbone. The phosphorus is therefore not present as a discrete low-molecular-weight additive. Boiling-water extraction of cured laminates based on DOPO-HQ chemistry commonly shows lower phosphorus migration than non-reactive phosphate esters, although exact extraction values depend on epoxy equivalent weight, cure conversion, and glass fabric style. Published data for this specific product configuration is limited, so comparative testing on the final laminate is required.
Compared with DOPO, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, DFS1719-06 provides a different reactive pathway. DOPO contains a P–H bond and is normally pre-reacted with epoxy resin or an unsaturated intermediate before polymerization. DFS1719-06 avoids the P–H addition step and behaves as a phosphorus-bearing dihydric phenol. Its theoretical hydroxyl value is 346 mg KOH/g; manufacturer-controlled material typically falls in the range 320–340 mg KOH/g. This difunctionality allows the product to act as a chain extender rather than a chain terminator. In epoxy formulations, one mole of DFS1719-06 can consume two epoxy equivalents, whereas a monofunctional modifier would cap the network and reduce crosslink density.
Manufacturer-defined control ranges for DFS1719-06 are listed below.
| Property | Typical Value or Range | Test Basis |
|---|---|---|
| Appearance | White to off-white crystalline powder | Visual inspection |
| Purity | ≥98.5 area% | HPLC-UV |
| Phosphorus content | 9.5–9.7 wt% | ICP-OES, ISO 11885 |
| Melting point | 247–254 °C | DSC at 10 K/min in N₂, ISO 11357-1 |
| Loss on drying | ≤0.5 wt% | 105 °C, 2 h, ISO 787-2 |
| Hydroxyl value | 320–340 mg KOH/g | Acetylation titration |
| Molecular weight | 324.27 g/mol | From molecular formula |
Solubility is formulation-relevant. The powder dissolves readily in methyl ethyl ketone, dimethylformamide, and dimethylacetamide at 40–60 °C. Solubility in methyl ethyl ketone above 25 g/100 mL is sufficient for high-solids prepreg stock solutions. Solubility in water and nonpolar solvents is low. In epoxy resin systems, the product is first dissolved in methyl ethyl ketone or a methyl ethyl ketone/propylene glycol methyl ether mixture before addition to the main resin batch. Direct dry blending into high-viscosity epoxy resin without solvent is not recommended because undissolved particles can persist in the glass fabric and create phosphorus-rich regions with cure inhomogeneity.
In a horizontal or vertical prepreg treater, the product is first dissolved in methyl ethyl ketone or a methyl ethyl ketone/propylene glycol methyl ether mixture at 40–60 °C. A high-solids varnish at 55–65 wt% solids and bath temperature of 25–35 °C is used. Varnish viscosity measured by ISO 2884-1 typically remains between 15 s and 25 s on a Zahn #2 cup at 25 °C. Above 25 s, wet-out of 7628 glass fabric becomes non-uniform, producing dry fiber regions that reduce dielectric and mechanical strength. A catalyst of 2-methylimidazole at 0.05–0.15 phr is used with dicyandiamide. The product is less sensitive to catalyst-induced pot-life reduction than DOPO because the P–H bond is already oxidized. However, the phenolic groups can advance epoxy resin at treater drying temperatures. B-stage advancement is controlled by limiting drying-zone residence at 120–160 °C and by monitoring resin flow before press lamination.
Lamination cure cycles for halogen-free FR-4 containing DFS1719-06 commonly operate at 170–190 °C for 60–90 min at 1.8–2.4 MPa. The DSC cure exotherm for a bisphenol A epoxy/dicyandiamide system containing DFS1719-06 typically shows an onset near 150 °C and a peak near 180 °C at a heating rate of 10 K/min under nitrogen. The exotherm is broader than an unmodified bisphenol A/dicy system, and the peak temperature can shift by 10–15 °C depending on the phenolic-to-epoxy ratio. Gel time at 171 °C is commonly 180–260 s. Formulations accelerated above 0.15 phr 2-methylimidazole may shorten gel time but can lose flow during lamination and cause voids. The lamination flow window is therefore narrower than that of many brominated FR-4 systems, and press-loading timing and pressure ramp must be adjusted accordingly.
For epoxy molding compounds, the product is pre-reacted with epoxy resin or compounded in a co-rotating twin-screw extruder with L/D 40:1 at barrel temperatures below 110 °C. The powder is added after the base resin is fused, and melt temperature is monitored below 120 °C. At melt temperatures above 135 °C, the reactive phenolic groups can prematurely advance an epoxy novolac matrix. Spiral flow measured according to ASTM D3123 may decline by more than 15% when the compound is over-advanced. In such lines, the extruder is operated with a vacuum vent below -0.08 MPa and an inline melt-filter pack to remove undispersed particles. Typical loading is 15–25 wt% based on organic resin solids, depending on the target phosphorus level and the presence of silica filler.
Moisture exposure changes handling behavior. At relative humidity above 60%, the powder can adsorb sufficient water to create bubbles in high-solids varnish and prepreg. A pre-drying step at 105 °C for 2 h in a forced-air tray oven is applied when open storage has exceeded 8 h at 60% relative humidity. Dried material is used within 24 h or stored in sealed polyethylene-lined containers. In tropical manufacturing sites, a nitrogen purge on the powder feeder and varnish tank is used to maintain batch-to-batch viscosity and to prevent moisture condensation during open handling. The product is not typically shipped as a moisture-sensitive material under J-STD-020, but process humidity controls are tighter than those for brominated resin powders because the material is polar and can bind surface water.
High-solids formulations above 65 wt% require modified solvent handling. Methyl ethyl ketone alone may not provide enough dissolution at 40 °C; a mixed solvent system of methyl ethyl ketone and propylene glycol methyl ether acetate at a 70:30 weight ratio improves solubility and slows varnish evaporation in the treater. Viscosity measured by ASTM D445 at 25 °C remains below 2,000 mPa·s for a 65 wt% solids solution. At 70 wt% solids, undissolved DFS1719-06 may precipitate during cooling from 50 °C to 25 °C, producing a non-homogeneous varnish. In such cases, inline filtration through a 20 μm cartridge is recommended before the treater pan, and the varnish tank is jacketed at 40–45 °C. Extended hold times above 50 °C increase ring-opening of the phenolic groups and should be limited to 8 h to avoid viscosity rise and loss of prepreg wet-out.
In comparison with DOPO-MA-type carboxylic acid adducts, DFS1719-06 does not introduce strong acid functionality. The absence of carboxylic acid reduces the risk of accelerator neutralization and allows conventional dicyandiamide/imidazole cure design. In contrast, DOPO-MA can shorten varnish pot life and may require reformulation with lower imidazole loadings. Compared with brominated epoxy resin systems, DFS1719-06 requires close viscosity management because the product increases varnish solids and can raise resin melt viscosity before cure. In production trials, brominated FR-4 formulations may show prepreg resin flow of 25–35%. Halogen-free formulations using DFS1719-06 often require a similar flow range to fill 1 oz or 2 oz copper circuitry. If resin flow is below 20%, circuit filling fails; if flow is above 35%, resin starvation and glass exposure can occur.
Laminate reliability is commonly screened with a 260 °C solder dip for 60 s after moisture conditioning at 85 °C and 85% relative humidity. Formulations using DFS1719-06 can pass this screening when cure conversion is above 95%, as determined by DSC residual exotherm. If residual exotherm exceeds 5 J/g, voids or delamination can occur during solder float because the undercured network releases volatiles and has insufficient crosslink density. Compliance documentation for DFS1719-06 typically lists the material as halogen-free by formula and as not containing polybrominated biphenyls or polybrominated diphenyl ethers. It is therefore outside the substance restrictions for PBB and PBDE in Annex II of Directive 2011/65/EU. UL 94 V-0 performance depends on the complete laminate formulation and should be confirmed on the final construction according to ASTM D3801 or UL 94 vertical burn protocols.
