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Anhui Liwei Chemical Co., Limited.

RDP for XPS Board Adhesives

    • Product Name: RDP for XPS Board Adhesives
    • Factroy Site: Lingwu, Yinchuan, Ningxia, China
    • Price Inquiry: sales2@liwei-chem.com
    • Manufacturer: Anhui Liwei Chemical Co., Limited.
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    Specifications
    HS Code 780013
    Chemical Base Vinyl Acetate-Ethylene (VAE) Copolymer
    Appearance White, free-flowing powder
    Bulk Density 400-600 g/L
    Solids Content >=98%
    Ash Content 10-15%
    Ph Value 10 Aqueous Solution 6.0-8.0
    Particle Size Retained On 325 Mesh <=5%
    Minimum Film Forming Temperature Mfft 0-5°C
    Tensile Adhesion Strength Xps Substrate >=0.4 MPa
    Water Resistance Excellent, with minimal loss of adhesion after water immersion
    Water Retention High, improving cement hydration and workability
    Glass Transition Temperature Tg -5°C to 5°C
    Storage Stability 12 months in original sealed packaging under dry, cool conditions

    As an accredited RDP for XPS Board Adhesives factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing RDP for XPS board adhesives is packaged in 25 kg multi-layer paper bags with an inner plastic lining for moisture protection.
    Container Loading (20′ FCL) 20′ FCL of RDP for XPS board adhesives: palletized, dry, sealed containers, protected from moisture, stable stacking, full container load.
    Shipping RDP for XPS Board Adhesives is supplied as a free-flowing white powder in 25 kg multi-layer paper bags, palletized and shrink-wrapped for safe transport. It is non-hazardous per regulations, but must be kept dry and protected from moisture. Shipments are suitable for standard sea, air, or land freight with ample ventilation.
    Storage Store RDP for XPS board adhesives in a cool, dry area, ideally below 30°C, in original sealed packaging. Protect from moisture, humidity, and direct sunlight. Keep containers tightly closed when not in use. Under these conditions, shelf life is typically 6–12 months. Avoid stacking with heavy loads to prevent bag damage.
    Shelf Life Shelf life is approximately 12 months from production date when stored unopened in a cool, dry place.
    Application of RDP for XPS Board Adhesives

    Across Central European external thermal insulation composite system installations where extruded polystyrene boards are bonded to concrete, autoclaved aerated concrete, or masonry substrates, the conversion of a dry blend containing 25–40 kg of redispersible vinyl acetate–ethylene powder per 1000 kg dry mix (2.5–4.0 wt%) into a trowel-applied adhesive is the primary route for overcoming the low surface energy of XPS. The polymer powder is dry-blended into a mortar comprising 280–350 kg CEM I 42.5 R per tonne, 550–650 kg silica sand with a particle band of 0.1–0.5 mm, 50–100 kg limestone filler, 3–5 kg cellulose ether with a 2% solution viscosity of 40,000–70,000 mPa·s as measured by Brookfield RVT, and 0.5–1.0 kg air-entraining agent. Dry-mix production on a horizontal ribbon blender with a batch size of 2–5 t requires a pre-blend step in which the redispersible polymer, cellulose ether, and fine filler are mixed at 20–30 rpm for 10–15 min before the addition of cement and sand to limit polymer agglomeration caused by residual moisture in mineral components. Residual moisture in the sand must be maintained below 0.2% prior to dosing. On site, the powder is mixed with 22–24% water by dry weight using a forced-action paddle mixer at 400–600 rpm for 3 min, slaked for 5 min, and remixed for 30 s. The wet adhesive is applied by 10×10 mm notched trowel to achieve a minimum contact area of 40% of the XPS board face, after which the board is pressed onto the substrate and aligned within the open time. Under ETAG 004 requirements, the cured adhesive must exhibit a tensile bond strength to XPS of not less than 0.08 MPa with cohesive failure within the XPS board after conditioning; the XPS boards themselves are specified under EN 13164. At an addition level below 2.0 wt%, field observations show a pronounced drop in wetting and cohesive failure in the insulation; above 4.0 wt%, the adhesive may exhibit unacceptable compressive creep for base-coat compatibility. The terminal product is a one-component dry-mix ETICS adhesive mortar packed in 25 kg moisture-barrier bags for use by plastering contractors.

    ComponentMass range per 1000 kg dry mixFunction or specification
    CEM I 42.5 R280–350 kgHydraulic binder, EN 197-1
    Silica sand550–650 kgAggregate, 0.1–0.5 mm
    Limestone filler50–100 kgFiller and particle packing
    Cellulose ether3–5 kgWater retention, 40,000–70,000 mPa·s Brookfield RVT
    VAE redispersible polymer powder25–40 kgAdhesion to XPS, film formation, flexibility
    Air-entraining agent0.5–1.0 kgFrost resistance and wet-state workability

    Can a 2.0 wt% Vinyl Acetate–Ethylene Powder Preserve C2TE Tensile Adhesion After Water Immersion When Bonding XPS Tile Backer Boards?

    For thin-bed cementitious adhesives used to bond XPS tile backer boards to concrete and wooden subfloors prior to ceramic or natural stone installation, the defect mechanism is not solely wetting but also water-immersion bond retention. Formulations designed for this application typically operate at 1.8–2.5 wt% redispersible polymer powder by total dry mix mass, lower than in ETICS adhesives because the adhesive layer must also carry tile dead load and dynamic point loads without excessive polymer-induced creep. The dry blend is produced in a continuous twin-shaft mixer with gravimetric dosing of the polymer powder to a tolerance of ±0.5%; it includes 300–380 kg CEM I 52.5 R or 42.5 R per 1000 kg, 500–600 kg washed quartz sand in the 0.1–0.6 mm band, 60–120 kg calcium carbonate filler, 2.5–4.0 kg cellulose ether, and 1.0–2.0 kg calcium formate for early strength development. The mixed mortar has a water demand of 23–25% and is applied with a 6×6 mm or 8×8 mm square-notched trowel to the structural floor; the XPS tile backer board is embedded with a sliding motion to ensure complete rib contact. After 24 h, a ceramic tile adhesive classified under EN 12004:2007+A1:2012 as C2TE S1 is applied over the board. The XPS backer board bonding mortar itself is assessed under the same EN 12004 framework because it functions as the substrate-preparation adhesive layer, with bond strength after water immersion required to remain at or above 1.0 MPa for C2-type formulations. At polymer addition below 1.5 wt%, laboratory pull tests show adhesive fracture at the XPS interface after 7-day water immersion; above 2.5 wt%, open time is extended but early strength development may fall below the floor-tiling installation schedule. The terminal product is a polymer-modified thin-bed adhesive packaged in 20 kg paper sacks with an internal polyethylene liner.

    When Rooftop XPS Board Bonding Is Carried Out Below 5°C, Minimum Film Formation Temperature of the Redispersible Polymer Becomes the Process Gate

    Cold-weather installation of XPS insulation boards over concrete and bituminous rooftop decks places the redispersible polymer powder’s minimum film formation temperature ahead of standard adhesive workability in the process-control hierarchy. In such operations, the substrate temperature is often between 2°C and 5°C, and cement hydration is retarded; the polymer must coalesce into a continuous film at the XPS interface without the thermal assistance available in normal ETICS façade work. Formulations for this configuration typically use a vinyl acetate–ethylene or styrene–acrylic redispersible powder with an MFFT not exceeding 0°C and a dosage of 3.0–3.5 wt% of the dry mix. The dry mortar is blended with 280–340 kg CEM I 42.5 R, 520–620 kg quartz sand, 80–120 kg limestone, 3.0–5.0 kg medium-viscosity cellulose ether, and 0.5–1.0 kg calcium formate per 1000 kg; the calcium formate is kept separate from the redispersible polymer in the feeding sequence to avoid premature water uptake from humid aggregates. Site mixing uses 21–23% water, and the water temperature is controlled below 25°C to avoid flash setting of the cement, while board placement is restricted to a closed weather window with relative humidity below 80%. Because the bondline is exposed to waterproofing and thermal expansion stresses, long-term performance is verified using the ETAG 004 bond test after freeze-thaw cycling, though published data for this specific rooftop configuration remains limited. The XPS boards must meet EN 13164 dimensional stability class DS(70,90), while the waterproofing layer itself is specified separately under EN 13956. The output is a cold-weather dry-mix board adhesive in 25 kg bags for exposed deck work.

    In below-grade perimeter retrofits where XPS thermal break panels are applied to basement walls and slab edges, the critical formulation target is not façade wind-load bond but reduced moisture-vapour transmission across the adhesive layer. Redispersible polymer addition in this segment is normally held between 2.0 wt% and 2.8 wt% of dry mix, because excessive polymer content can lower the vapour diffusion resistance of the hardened mortar and create a condensation plane at the XPS interface. The dry formulation combines 300–360 kg CEM II/A-LL 42.5 R, 480–560 kg fine quartz sand in the 0.1–0.4 mm band, 80–120 kg limestone filler, 2.5–4.0 kg cellulose ether, 20–28 kg vinyl acetate–ethylene redispersible polymer, and 0.5–1.0 kg hydrophobic additive per tonne. Production is conducted in a low-shear planetary paddle mixer at plant scale, with total blend time not exceeding 20 min to limit electrostatic segregation of the polymer powder. On site, the mortar is mixed at 20–22% water and applied with an 8×8 mm or 10×10 mm notched trowel to the concrete or masonry substrate; XPS panels with shiplap or square edges are pressed into the adhesive within 10–15 min. Because no dedicated product standard for interior thermal break board adhesives is published at the present time, manufacturers qualify this mortar using the ETAG 004 adhesion method adapted to 23°C/50% RH conditioning and indoor VOC emission testing under EN 16516. Adhesion to XPS below 0.06 MPa after the adapted conditioning is treated as a batch failure, not because of load-bearing risk but because it signals incomplete polymer film formation at the low-energy surface. The finished product is a medium-flex interior insulation board adhesive supplied in 25 kg bags.

    High-Shear Dispersion, Open-Time Control, and Foam-Control Limits in Continuous XPS Core Lamination Lines

    In factory prefabrication of XPS-core sandwich panels for modular façade and partition elements, the adhesive is processed as a slurry rather than a thick trowel mortar, and the main process failure mode is shear-induced destabilisation of the redispersed polymer. The slurry adhesive typically contains redispersible polymer powder at 3.0–5.0 wt% based on wet slurry mass, combined with 200–350 kg cement per 1000 kg wet mix, 100–180 kg fine limestone, 2.0–4.0 kg cellulose ether, 0.3–0.8 kg defoamer, and 0.5–1.0 kg polycarboxylate superplasticiser. Dispersion is executed in a vacuum dissolver with a tip speed of 6–10 m/s for 15–20 min; air entrainment must be kept below 5% by volume to avoid pinhole defects at the XPS skin. The slurry is metered onto the panel line through a slot-die or roller coater at 300–500 g/m² wet coverage, with a pot life of 60–90 min maintained by ambient temperature control at 20±2°C. Application onto XPS skins with a surface energy below 32 mN/m requires corona pre-treatment or intensive mechanical wiping before coating; without surface preparation, peel adhesion can fall below 0.05 N/mm² even at the upper polymer dose. Fire performance of the finished composite is assessed under EN 13501-1, while the XPS core must comply with EN 13164 and the facing boards with EN 12467 where fibre-cement sheets are used. The output is a prefabricated XPS-cored building panel, such as an insulated façade or partition element, bonded with a factory-applied polymer-cement slurry.

    Application zoneStandard or test methodRequired value or limit
    ETICS wall adhesive to XPSETAG 004 tensile bond test0.08 MPa, cohesive failure in XPS
    XPS raw boardEN 13164Dimensional stability class DS(70,90)
    XPS tile backer board bonding mortarEN 12004 C2TE1.0 MPa after water immersion
    Interior thermal break adhesiveETAG 004 adapted, EN 165160.06 MPa; indoor VOC emission limit
    Factory XPS core laminationEN 13501-1, EN 13164, EN 12467Reaction-to-fire class, core and facing specifications
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    Certification & Compliance
    More Introduction

    RDP for XPS Board Adhesives, designated RDP-XPS 501A, is a spray-dried redispersible polymer powder based on a vinyl acetate–ethylene copolymer with a poly(vinyl alcohol) protective colloid and a mineral anti-caking agent. The powder is intended for cementitious dry-mix adhesives used to bond extruded polystyrene insulation boards in external thermal insulation composite systems and floor-leveling upgrades. The ethylene comonomer content is selected to produce a glass transition temperature of 0 °C to 5 °C by ISO 11357-2 and a minimum film formation temperature of 0 °C to 4 °C by ISO 2115, allowing the polymer to coalesce without volatile coalescing solvents. Dry-powder handling is controlled by an apparent bulk density of 400 g/L to 600 g/L per ISO 60 and a sieve residue of not more than 2 % on a 400 µm screen per ISO 2591-1.

    The redispersed slurry at 50 % solids has a pH of 6.0 to 8.0 per ISO 976 and a Brookfield viscosity of 2,000 mPa·s to 5,000 mPa·s at 20 °C with spindle 4 at 20 min⁻¹ per ISO 2555. The ash content after ignition at 1000 °C is 8 % to 14 % per ISO 3451-1, and the volatile matter after 1 h at 105 °C is not more than 2 % per ISO 3251. The primary latex particle size after redispersion is typically 0.5 µm to 5 µm when measured by laser diffraction per ISO 22412. Insoluble residue above 1 % on a 125 µm screen indicates incomplete redispersion caused by over-shear during powder production or excessive storage humidity.

    A second model in the same product family, RDP-XPS 501B, carries a higher ethylene content and is intended for cold-region formulations where board bonding continues at 0 °C to 2 °C. The trade-off is a lower film tensile strength of approximately 0.4 MPa compared with 0.6 MPa for RDP-XPS 501A under identical cure conditions. The model selection therefore depends on whether the application priority is low-temperature coalescence or final film strength.

    Which Batch-Release Specification Ranges Govern Acceptance on a Dry-Mix Production Line?

    ParameterTest methodRelease limit
    AppearanceVisual inspectionWhite to off-white free-flowing powder
    Apparent bulk densityISO 60400 g/L600 g/L
    Sieve residue >400 µmISO 2591-12 %
    Minimum film formation temperatureISO 21150 °C4 °C
    Glass transition temperatureISO 11357-20 °C5 °C
    pH at 50 % solidsISO 9766.08.0
    Brookfield viscosity at 50 % solidsISO 25552,000 mPa·s5,000 mPa·s
    Ash at 1000 °CISO 3451-18 %14 %
    Volatile matter after 1 h at 105 °CISO 32512 %

    These batch-release values are necessary but not sufficient for predicting final adhesive performance. In a 500 L horizontal ploughshare mixer with an agitator tip speed of 3.0 m/s, the powder is added after mineral components to avoid compaction of the soft polymer shells. The discharge temperature is held below 35 °C; above this threshold, the polymer particles soften and may aggregate into non-redispersible lumps. The coefficient of variation for redispersed solids across three consecutive batches was below 1.0 %, indicating adequate homogenization without over-shear.

    The dry-mix dosage of RDP-XPS 501A in XPS board adhesives ranges from 1.5 % to 3.5 % by total dry powder weight, depending on the wind load class, insulation board thickness, and substrate composition. The dry adhesive is mixed with 0.22 L to 0.26 L of water per kilogram of dry powder, yielding a wet density of 1,500 kg/m³ to 1,700 kg/m³. After mixing, the fresh mortar is combed with a notched trowel of 10 mm × 10 mm to 12 mm × 12 mm and the XPS board is pressed within 20 min to 30 min at 23 °C and 50 % RH. The open time is governed by the skin formation period of the redispersed polymer; after the surface skin appears, wetting of the closed-cell XPS surface decreases and the failure mode shifts from adhesive to interfacial.

    The water retention of the fresh mortar measured by EN 1015-8 after 10 min is typically 85 % to 95 % at a 3.0 % polymer content. This range permits cement hydration at the insulation interface to continue despite the non-absorptive XPS surface and reduces premature drying. The polymer also lowers the E-modulus of the cured adhesive and improves resistance to thermally induced movement between the XPS board and the mineral substrate; however, the primary water-retention agent remains the cellulose ether component, and formulators must not use RDP alone to achieve the water retention required for thin-bed application.

    At the interface with cement, the poly(vinyl alcohol) colloid adsorbs onto hydrating silicate surfaces and can extend the setting time. In Vicat measurements per EN 196-3, a formulation containing 3.0 % RDP-XPS 501A typically shows an initial setting time of 180 min to 240 min compared with 120 min to 150 min for the same mortar without the polymer. This retardation is useful for prolonged open time but must be compensated with a compatible accelerator when facade finishing in cold weather requires early mechanical fixing.

    When Installation Surface Temperatures Fall Below 5 °C, Polymer Film Formation and Early Strength Shift

    At substrate temperatures between 0 °C and 5 °C, the low-MFFT VAE copolymer in RDP-XPS 501A coalesces into a continuous film, while a standard acrylate redispersible powder with an MFFT above 8 °C may remain in particulate form and reduce wet adhesion to closed-cell XPS. In comparative film tests, a 3.0 % addition of RDP-XPS 501A produced a redispersed polymer film with a tensile strength of 0.6 MPa and an elongation at break of 250 % after 7 days at 23 °C and 50 % RH when tested by ISO 527-2. At 4 °C, the early XPS adhesion at 24 h was 0.05 MPa, indicating that cement hydration still controls the first day while polymer film formation contributes to long-term flexibility and water resistance. Below 0 °C, frost exposure before final set is a known failure mode; the installed adhesive must be protected with insulated sheeting, and published data for this specific configuration at below-zero temperatures is limited.

    Polymer addition also increases the air-entraining tendency. At 3.0 % dosage, the air content of the wet mortar measured by EN 1015-7 is 5 % to 12 %, depending on mixer speed and aggregate angularity. This air volume reduces wet density and improves workability, but values above 15 % can lower compressive strength below the ETICS mechanical requirement and require a defoamer. The powder contributes to slip resistance and tack after the board is pressed. In inclined-board tests at 23 °C, a 3.0 % dosage increases the time to sag against a vertical XPS board to more than 10 min compared with less than 5 min for the unmodified control, as assessed by the slip resistance procedure in EN 1308. The primary slip-control agent in many formulations remains a high-viscosity cellulose ether or starch ether.

    Compared with acrylic redispersible powders, the VAE polymer in RDP-XPS 501A provides higher wet adhesion to closed-cell XPS because the ethylene comonomer lowers the interfacial free energy without forming a brittle film. Compared with poly(vinyl alcohol) powder, the VAE film absorbs 8 % to 15 % water after 24 h immersion, whereas PVOH films commonly exceed 30 % water uptake and lose mechanical integrity under rain exposure. Compared with liquid styrene-butadiene rubber latex, the dry powder eliminates biocides, freeze-thaw instability, and separate liquid dosing pumps but requires dry blending precision and is not suitable for hot-water mixing above 40 °C because the polymer shells may coalesce before cement hydration.

    Comparative Response of VAE, Acrylic, PVOH, and SBR Systems in XPS Board Adhesives

    SystemMinimum film formation temperatureFilm water uptake after 24 h immersionAdhesion to XPS after water immersionStorage behaviour
    VAE RDP (RDP-XPS 501A)0 °C4 °C8 %15 %0.03 MPa0.06 MPa by EAD 040083-00-040412 months in unopened bags at 5 °C30 °C
    Acrylic RDP5 °C15 °C depending on copolymer composition10 %18 %0.02 MPa0.05 MPa typical12 months, requires moisture protection
    PVOH powder20 °C30 °C> 30 %often below 0.03 MPa after water immersionhygroscopic, shorter open time in high humidity
    SBR liquid latexnot applicable; film forms on drying5 %10 %0.03 MPa0.08 MPa typicalfreeze-thaw unstable, requires biocides and liquid dosing

    The product must not be blended with amine-based accelerators because free amine groups destabilize the poly(vinyl alcohol) colloid and produce flocculation in the wet slurry. The powder is incompatible with strong acids and strong alkalis outside the pH range of 6 to 12. In storage, relative humidity above 60 % requires pre-drying or dehumidified warehousing, and opened bags must be resealed and consumed within 24 h to prevent crusting. Unopened shelf life is 12 months from the production date at 5 °C to 30 °C. Mixer discharge temperatures above 35 °C and final wet-adhesive temperatures above 40 °C should be avoided because the polymer shell softens and forms non-redispersible aggregates that appear as lumps in the applied adhesive.

    For European ETICS applications, adhesive formulations containing RDP-XPS 501A are qualified under EAD 040083-00-0404, with dry-state adhesion to XPS of not less than 0.08 MPa and wet-state adhesion of not less than 0.03 MPa as minimum pass values. The powder is manufactured under an ISO 9001 quality management system. No formaldehyde is intentionally added, and the volatile organic content of the dry powder is below the detection limit of standard headspace chromatography as applied to powdered polymers.